摘要:
Active material for a positive electrode of a rechargeable alkaline electrochemical cell is made with nickel hydroxide particles or cobalt-coated nickel hydroxide particles treated with strongly oxidizing reagents such as alkali metal persulfate in alkaline solution. The active material also may be made with cobalt-coated nickel hydroxide particles having a high percentage of cobalt(III) on a surface or an average cobalt oxidation state of about 3 measured across the particles. The treated nickel hydroxide or cobalt-coated nickel hydroxide decreases the cobalt solubility in the alkaline electrolyte and increases the high-rate charge and discharge capability. The lower cobalt solubility decreases cobalt migration that can increase self discharge and lead to premature failure.
摘要:
Active material for a positive electrode of a rechargeable alkaline electrochemical cell is made with nickel hydroxide particles or cobalt-coated nickel hydroxide particles treated with strongly oxidizing reagents such as alkali metal persulfate in alkaline solution. The active material also may be made with cobalt-coated nickel hydroxide particles having a high percentage of cobalt(III) on a surface or an average cobalt oxidation state of about 3 measured across the particles. The treated nickel hydroxide or cobalt-coated nickel hydroxide decreases the cobalt solubility in the alkaline electrolyte and increases the high-rate charge and discharge capability. The lower cobalt solubility decreases cobalt migration that can increase self discharge and lead to premature failure.
摘要:
An improved Ni—Zn cell with a negative electrode substrate plated with tin or tin and zinc during manufacturing has a reduced gassing rate. The copper or brass substrate is electrolytic cleaned, activated, electroplated with a matte surface to a defined thickness range, pasted with zinc oxide electrochemically active material, and baked. The defined plating thickness range of 40-80 μIn maximizes formation of an intermetallic compound Cu3Sn that helps to suppress the copper diffusion from under plating layer to the surface and eliminates formation of an intermetallic compound Cu6Sn5 during baking to provide adequate corrosion resistance during battery operation.
摘要:
An improved Ni—Zn cell with a negative electrode substrate plated with tin or tin and zinc during manufacturing has a reduced gassing rate. The copper or brass substrate is electrolytic cleaned, activated, electroplated with a matte surface to a defined thickness range, pasted with zinc oxide electrochemically active material, and baked. The defined plating thickness range of 40-80 μIn maximizes formation of an intermetallic compound Cu3Sn that helps to suppress the copper diffusion from under plating layer to the surface and eliminates formation of an intermetallic compound Cu6Sn5 during baking to provide adequate corrosion resistance during battery operation.
摘要:
An improved Ni—Zn cell with a negative electrode substrate plated with tin or tin and zinc during manufacturing has a reduced gassing rate. The copper or brass substrate is electrolytic cleaned, activated, electroplated with a matte surface to a defined thickness range, pasted with zinc oxide electrochemically active material, and baked. The defined plating thickness range of 40-80 μIn maximizes formation of an intermetallic compound Cu3Sn that helps to suppress the copper diffusion from under plating layer to the surface and eliminates formation of an intermetallic compound Cu6Sn5 during baking to provide adequate corrosion resistance during battery operation.
摘要:
A nickel zinc battery cell includes a metallic zinc-based current collection substrate as a part of the negative electrode. The metallic zinc-based current collector may be made of or be coated with a zinc metal or zinc alloy material and may be a foil, perforated, or expanded material. Battery cells incorporating the zinc-based current collector exhibit good cycle lifetime and initial charge performance.
摘要:
A nickel zinc battery cell includes a metallic zinc-based current collection substrate as a part of the negative electrode. The metallic zinc-based current collector may be made of or be coated with a zinc metal or zinc alloy material and may be a foil, perforated, or expanded material. Battery cells incorporating the zinc-based current collector exhibit good cycle lifetime and initial charge performance.
摘要:
An improved Ni—Zn cell with a negative electrode substrate plated with tin or tin and zinc during manufacturing has a reduced gassing rate. The copper or brass substrate is electrolytic cleaned, activated, electroplated with a matte surface to a defined thickness range, pasted with zinc oxide electrochemically active material, and baked. The defined plating thickness range of 40-80 μIn maximizes formation of an intermetallic compound Cu3Sn that helps to suppress the copper diffusion from under plating layer to the surface and eliminates formation of an intermetallic compound Cu6Sn5 during baking to provide adequate corrosion resistance during battery operation.
摘要:
An improved Ni—Zn cell with a negative electrode substrate plated with tin or tin and zinc during manufacturing has a reduced gassing rate. The copper or brass substrate is electrolytic cleaned, activated, electroplated with a matte surface to a defined thickness range, pasted with zinc oxide electrochemically active material, and baked. The defined plating thickness range of 40-80 μIn maximizes formation of an intermetallic compound Cu3Sn that helps to suppress the copper diffusion from under plating layer to the surface and eliminates formation of an intermetallic compound Cu6Sn5 during baking to provide adequate corrosion resistance during battery operation.
摘要:
An improved Ni—Zn cell with a negative electrode substrate plated with tin or tin and zinc during manufacturing has a reduced gassing rate. The copper or brass substrate is electrolytic cleaned, activated, electroplated with a matte surface to a defined thickness range, pasted with zinc oxide electrochemically active material, and baked. The defined plating thickness range of 40-80 μIn maximizes formation of an intermetallic compound Cu3Sn that helps to suppress the copper diffusion from under plating layer to the surface and eliminates formation of an intermetallic compound Cu6Sn5 during baking to provide adequate corrosion resistance during battery operation.