INSPECTION METHOD AND DEVICE THEREFOR
    1.
    发明申请
    INSPECTION METHOD AND DEVICE THEREFOR 有权
    检查方法及其设备

    公开(公告)号:US20130108147A1

    公开(公告)日:2013-05-02

    申请号:US13639103

    申请日:2011-04-01

    IPC分类号: G06T7/00

    摘要: Disclosed is a method of inspecting an object to be inspected in a semiconductor manufacturing process, for resolving the problem to increase defect detection sensitivity. An image capture means is used to image capture a designated area of the object to be inspected; a defect is detected in the captured image; a circuit pattern is recognized from the captured image; a characteristic value is computed, relating to an image tone and shape, from the detected defect; a characteristic value is computed, relating to the image tone and shape, from the recognized circuit pattern; either a specified defect or circuit pattern is filtered and extracted from the detected defect and the recognized circuit pattern; a mapping characteristic value is determined from the characteristic value of either the filtered and extracted specified defect or circuit pattern; and the distribution of the determined characteristic values is displayed onscreen in a map format.

    摘要翻译: 公开了一种在半导体制造过程中检查被检查物体的方法,用于解决问题以增加缺陷检测灵敏度。 图像捕捉装置用于对要检查的对象的指定区域进行图像捕获; 在捕获的图像中检测到缺陷; 从捕获的图像识别电路图案; 从检测到的缺陷中计算与图像色调和形状相关的特征值; 根据识别的电路图案计算与图像色调和形状相关的特征值; 从检测到的缺陷和识别的电路图案中滤出并提取指定的缺陷或电路图案; 根据滤波和提取的指定缺陷或电路图案的特征值确定映射特征值; 并且以映射格式在屏幕上显示所确定的特征值的分布。

    METHOD AND DEVICE FOR TESTING DEFECT USING SEM
    2.
    发明申请
    METHOD AND DEVICE FOR TESTING DEFECT USING SEM 有权
    使用SEM测试缺陷的方法和装置

    公开(公告)号:US20130070078A1

    公开(公告)日:2013-03-21

    申请号:US13520210

    申请日:2010-12-22

    IPC分类号: H04N7/18

    摘要: In performing a programmed-point inspection of a circuit pattern using a review SEM, stable inspection can be performed while suppressing the generation of a false report even when a variation in a circuit pattern to be inspected is large. SEM images that are obtained by sequentially imaging a predetermined circuit pattern using the review SEM are stored into a storage unit. Images that meet a set condition are selected from the stored SEM images, and averaged to create an average image (GP image). By performing pattern check by GP comparison using this GP image, an inspection can be performed while suppressing the generation of a false report even when a variation in the circuit patterns is large.

    摘要翻译: 在使用复查SEM执行电路图案的编程点检查时,即使在要检查的电路图案的变化大的情况下,也可以抑制误报的产生而进行稳定的检查。 通过使用评价SEM将预定电路图案顺序成像获得的SEM图像存储在存储单元中。 从存储的SEM图像中选择满足设定条件的图像,并平均以创建平均图像(GP图像)。 通过使用该GP图像通过GP比较进行模式检查,即使当电路图案的变化大时也可以在抑制伪报告的产生的同时执行检查。

    Method and device for testing defect using SEM
    3.
    发明授权
    Method and device for testing defect using SEM 有权
    使用SEM测试缺陷的方法和装置

    公开(公告)号:US09390490B2

    公开(公告)日:2016-07-12

    申请号:US13520210

    申请日:2010-12-22

    IPC分类号: H04N7/18 G06T7/00 H01L21/66

    摘要: In performing a programmed-point inspection of a circuit pattern using a review SEM, stable inspection can be performed while suppressing the generation of a false report even when a variation in a circuit pattern to be inspected is large. SEM images that are obtained by sequentially imaging a predetermined circuit pattern using the review SEM are stored into a storage unit. Images that meet a set condition are selected from the stored SEM images, and averaged to create an average image (GP image). By performing pattern check by GP comparison using this GP image, an inspection can be performed while suppressing the generation of a false report even when a variation in the circuit patterns is large.

    摘要翻译: 在使用复查SEM执行电路图案的编程点检查时,即使在要检查的电路图案的变化大的情况下,也可以抑制误报的产生而进行稳定的检查。 通过使用评价SEM将预定电路图案顺序成像获得的SEM图像存储在存储单元中。 从存储的SEM图像中选择满足设定条件的图像,并平均以创建平均图像(GP图像)。 通过使用该GP图像通过GP比较进行模式检查,即使当电路图案的变化大时也可以在抑制伪报告的产生的同时执行检查。

    Inspection method and device therefor
    4.
    发明授权
    Inspection method and device therefor 有权
    检验方法及装置

    公开(公告)号:US09311697B2

    公开(公告)日:2016-04-12

    申请号:US13639103

    申请日:2011-04-01

    IPC分类号: G06K9/00 G06T7/00 H01L21/66

    摘要: Disclosed is a method of inspecting an object to be inspected in a semiconductor manufacturing process, for resolving the problem to increase defect detection sensitivity. An image capture means is used to image capture a designated area of the object to be inspected; a defect is detected in the captured image; a circuit pattern is recognized from the captured image; a characteristic value is computed, relating to an image tone and shape, from the detected defect; a characteristic value is computed, relating to the image tone and shape, from the recognized circuit pattern; either a specified defect or circuit pattern is filtered and extracted from the detected defect and the recognized circuit pattern; a mapping characteristic value is determined from the characteristic value of either the filtered and extracted specified defect or circuit pattern; and the distribution of the determined characteristic values is displayed onscreen in a map format.

    摘要翻译: 公开了一种在半导体制造过程中检查被检查物体的方法,用于解决问题以增加缺陷检测灵敏度。 图像捕捉装置用于对要检查的对象的指定区域进行图像捕获; 在捕获的图像中检测到缺陷; 从捕获的图像识别电路图案; 从检测到的缺陷中计算与图像色调和形状相关的特征值; 根据识别的电路图案计算与图像色调和形状相关的特征值; 从检测到的缺陷和识别的电路图案中滤出并提取指定的缺陷或电路图案; 根据滤波和提取的指定缺陷或电路图案的特征值确定映射特征值; 并且以映射格式在屏幕上显示所确定的特征值的分布。

    Method and apparatus for reviewing defect
    5.
    发明授权
    Method and apparatus for reviewing defect 有权
    检查缺陷的方法和装置

    公开(公告)号:US09342879B2

    公开(公告)日:2016-05-17

    申请号:US14347127

    申请日:2012-07-06

    IPC分类号: G06K9/00 G06T7/00

    摘要: A method for reviewing defect, comprising the steps of: as an image acquisition step, imaging a surface of a sample using arbitrary image acquisition condition selected from a plurality of image acquisition conditions and obtaining a defect image; as a defect position calculation step, proceeding the defect image obtained by the image acquisition step and calculating a defect position on the surface of the sample; as a defect detection accuracy calculation step, obtaining a defect detection accuracy of the defect position calculated by the defect position calculation step; and as a conclusion determination step, determinating whether the defect detection accuracy obtained by the defect detection accuracy calculation step meets a predetermined requirement or not; wherein until it is determined that the defect detection accuracy obtained by the defect detection accuracy calculation step meets a predetermined in the conclusion determination step, the image acquisition condition is selected from the plurality of image acquisition conditions once again and the image acquisition step, the defect position calculation step, the defect detection accuracy calculation step and the conclusion determination step are repeated.

    摘要翻译: 一种检查缺陷的方法,包括以下步骤:作为图像获取步骤,使用从多个图像获取条件中选择的任意图像获取条件对样本的表面进行成像并获得缺陷图像; 作为缺陷位置计算步骤,进行通过图像获取步骤获得的缺陷图像,并计算样本表面上的缺陷位置; 作为缺陷检测精度计算步骤,获得由缺陷位置计算步骤计算的缺陷位置的缺陷检测精度; 以及作为结论确定步骤,确定由缺陷检测精度计算步骤获得的缺陷检测精度是否满足预定要求; 其中直到确定由缺陷检测精度计算步骤获得的缺陷检测精度在结论确定步骤中达到预定值时,再次从多个图像获取条件中选择图像获取条件,并且图像获取步骤,缺陷 位置计算步骤,重复缺陷检测精度计算步骤和结论确定步骤。

    DEFECT CLASSIFICATION METHOD, AND DEFECT CLASSIFICATION SYSTEM
    6.
    发明申请
    DEFECT CLASSIFICATION METHOD, AND DEFECT CLASSIFICATION SYSTEM 有权
    缺陷分类方法和缺陷分类系统

    公开(公告)号:US20140072204A1

    公开(公告)日:2014-03-13

    申请号:US14112105

    申请日:2012-04-16

    IPC分类号: G06T7/00 G06K9/62

    摘要: In automatic defect classification, a classification recipe must be set for each defect observation device. If a plurality of devices operate at the same stage, the classification class in the classification recipes must be the same. Problems have arisen whereby differences occur in the classification class in different devices when a new classification recipe is created. This defect classification system has a classification recipe storage unit; an information specification unit, the stage of a stored image, and device information. A corresponding defect specification unit specifies images of the same type of defect from images obtained from different image pickup devices at the same stage. An image conversion unit converts the images obtained from the different image pickup devices at the same stage into comparable similar images; and a recipe update unit records the classification classes in the classification recipes corresponding to the specified images of the same type of defect.

    摘要翻译: 在自动缺陷分类中,必须为每个缺陷观察装置设定分类处方。 如果多个设备在同一阶段进行操作,则分类配方中的分类等级必须相同。 当创建新的分类配方时,出现了在不同装置中的分类等级中发生差异的问题。 该缺陷分类系统具有分类配方存储单元; 信息指定单元,存储图像的级和设备信息。 相应的缺陷指定单元从在相同阶段从不同图像拾取装置获得的图像中指定相同类型的缺陷的图像。 图像转换单元将从相同阶段的不同图像拾取装置获得的图像转换成可比较的相似图像; 并且配方更新单元将分类类别记录在与相同类型的缺陷的指定图像相对应的分类配方中。

    IMAGE CLASSIFICATION METHOD AND IMAGE CLASSIFICATION APPARATUS
    7.
    发明申请
    IMAGE CLASSIFICATION METHOD AND IMAGE CLASSIFICATION APPARATUS 审中-公开
    图像分类方法和图像分类装置

    公开(公告)号:US20130294680A1

    公开(公告)日:2013-11-07

    申请号:US13979450

    申请日:2011-12-07

    IPC分类号: G06T7/00

    摘要: In an apparatus for automatically classifying an image picked up of a defect on a semiconductor wafer according to user defined class, when images picked up by a plurality of different observation apparatuses are inputted in a mixed manner, the defect image classification accuracy rate decreases due to image property differences corresponding to differences in the observation apparatuses. In an automatic image classification apparatus supplied with defect images picked up by a plurality of observation apparatuses, when preparing a recipe, image process parameters are adjusted and a classification discriminating surface is prepared for each observation apparatus. When classifying an image, the observation apparatus that picked up a defect image is identified based on accompanying information or the like of the image, and an image process and a classification process are performed by using the image process parameters and the classification discriminating surface corresponding to the observation apparatus that picked up the image. In order to efficiently adjust the image process parameters for each observation apparatus, appropriate image process parameters are automatically adjusted on the basis of an exemplified defect area. The image process parameters adjusted in a given observation apparatus may be used for setting the image process parameters for another observation apparatus.

    摘要翻译: 在根据用户定义的类别自动分类在半导体晶片上的缺陷拍摄的图像的装置中,当以混合方式输入由多个不同的观察装置拾取的图像时,缺陷图像分类精度率由于 对应于观察装置的差异的图像特性差异。 在提供有由多个观察装置拍摄的缺陷图像的自动图像分类装置中,在准备配方时,调整图像处理参数,并为每个观察装置准备分类鉴别表面。 当对图像进行分类时,基于图像的伴随信息等识别拾取缺陷图像的观察装置,并且通过使用图像处理参数和对应于图像处理参数的分类识别表面来执行图像处理和分类处理 拾取图像的观察装置。 为了有效地调整每个观察装置的图像处理参数,基于示例的缺陷区域自动调整适当的图像处理参数。 在给定观察装置中调整的图像处理参数可以用于设置用于另一观察装置的图像处理参数。

    Defect classification method, and defect classification system
    8.
    发明授权
    Defect classification method, and defect classification system 有权
    缺陷分类方法和缺陷分类系统

    公开(公告)号:US09401015B2

    公开(公告)日:2016-07-26

    申请号:US14112105

    申请日:2012-04-16

    摘要: In automatic defect classification, a classification recipe must be set for each defect observation device. If a plurality of devices operate at the same stage, the classification class in the classification recipes must be the same. Problems have arisen whereby differences occur in the classification class in different devices when a new classification recipe is created. This defect classification system has a classification recipe storage unit; an information specification unit, the stage of a stored image, and device information. A corresponding defect specification unit specifies images of the same type of defect from images obtained from different image pickup devices at the same stage. An image conversion unit converts the images obtained from the different image pickup devices at the same stage into comparable similar images; and a recipe update unit records the classification classes in the classification recipes corresponding to the specified images of the same type of defect.

    摘要翻译: 在自动缺陷分类中,必须为每个缺陷观察装置设定分类处方。 如果多个设备在同一阶段进行操作,则分类配方中的分类等级必须相同。 当创建新的分类配方时,出现了在不同装置中的分类等级中出现差异的问题。 该缺陷分类系统具有分类配方存储单元; 信息指定单元,存储图像的级和设备信息。 相应的缺陷指定单元从在相同阶段从不同图像拾取装置获得的图像中指定相同类型的缺陷的图像。 图像转换单元将从相同阶段的不同图像拾取装置获得的图像转换成可比较的相似图像; 并且配方更新单元将分类类别记录在与相同类型的缺陷的指定图像相对应的分类配方中。

    DEFECT CLASSIFICATION SYSTEM AND DEFECT CLASSIFICATION DEVICE AND IMAGING DEVICE
    9.
    发明申请
    DEFECT CLASSIFICATION SYSTEM AND DEFECT CLASSIFICATION DEVICE AND IMAGING DEVICE 审中-公开
    缺陷分类系统和缺陷分类设备和成像设备

    公开(公告)号:US20130222574A1

    公开(公告)日:2013-08-29

    申请号:US13878256

    申请日:2011-10-03

    IPC分类号: G06T7/00

    摘要: In a defect classification system using plural types of observation devices that acquire images having different characteristics, classification performance and operability of the system are improved. The a defect classification system includes plural imaging part that acquire images of an inspection target, a defect classification device that classifies the acquired images acquired by the plural imaging part, and a communication part that transmits data between the plural imaging devices and the defect classification device, in which the defect classification device includes an image storage part that stores the acquired image data acquired by the plural imaging part, an information storage part that stores associated information about the input image data, and a part for changing a processing method or a display method depending on the associated information.

    摘要翻译: 在采用获取具有不同特征的图像的多种观察装置的缺陷分类系统中,提高了系统的分类性能和可操作性。 缺陷分类系统包括获取检查对象的图像的多个成像部,对由多个成像部获取的获取图像进行分类的缺陷分类装置,以及在多个成像装置与缺陷分类装置之间发送数据的通信部 ,其中所述缺陷分类装置包括存储由所述多个成像部分获取​​的获取的图像数据的图像存储部分,存储关于输入图像数据的相关信息的信息存储部分,以及用于改变处理方法或显示的部分 方法取决于相关信息。

    METHOD FOR DEFECT INSPECTION AND APPARATUS FOR DEFECT INSPECTION
    10.
    发明申请
    METHOD FOR DEFECT INSPECTION AND APPARATUS FOR DEFECT INSPECTION 审中-公开
    缺陷检查方法和缺陷检查装置

    公开(公告)号:US20120257041A1

    公开(公告)日:2012-10-11

    申请号:US13513258

    申请日:2010-11-22

    IPC分类号: H04N7/18

    摘要: Provided is a technique for a wafer inspection conducted by simple operation, which is useful even when the inspection covers a variety of items and the inspection items are changed frequently with time like in a start-up period of a semi-conductor process. According to the technique, inspection images are collected, and then a template is prepared from the inspection images. A plurality of regions are defined on the template, and inspection methods and output indexes are registered in correspondence with the respective regions. In the inspection, by reference to the template images corresponding to the derived inspection images, the inspection is conducted based on the inspection information registered therein and the quantitative output levels are calculated.

    摘要翻译: 提供了一种通过简单的操作进行的晶片检查的技术,即使在检查覆盖各种物品并且检查项目在半导体处理的启动期间随时间频繁地变化也是有用的。 根据该技术,收集检查图像,然后从检查图像准备模板。 在模板上定义多个区域,并且与各个区域对应地登记检查方法和输出索引。 在检查中,参考与导出的检查图像对应的模板图像,基于登记在其中的检查信息进行检查,并计算定量输出水平。