公开(公告)号：US09342879B2

公开(公告)日：2016-05-17

申请号：US14347127

申请日：2012-07-06

申请人： Yohei Minekawa ,  Kenji Nakahira ,  Minoru Harada ,  Takehiro Hirai ,  Ryo Nakagaki

发明人： Yohei Minekawa ,  Kenji Nakahira ,  Minoru Harada ,  Takehiro Hirai ,  Ryo Nakagaki

IPC分类号： G06K9/00 ,  G06T7/00

CPC分类号： G06T7/0004 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/20016 ,  G06T2207/30148

摘要： A method for reviewing defect, comprising the steps of: as an image acquisition step, imaging a surface of a sample using arbitrary image acquisition condition selected from a plurality of image acquisition conditions and obtaining a defect image; as a defect position calculation step, proceeding the defect image obtained by the image acquisition step and calculating a defect position on the surface of the sample; as a defect detection accuracy calculation step, obtaining a defect detection accuracy of the defect position calculated by the defect position calculation step; and as a conclusion determination step, determinating whether the defect detection accuracy obtained by the defect detection accuracy calculation step meets a predetermined requirement or not; wherein until it is determined that the defect detection accuracy obtained by the defect detection accuracy calculation step meets a predetermined in the conclusion determination step, the image acquisition condition is selected from the plurality of image acquisition conditions once again and the image acquisition step, the defect position calculation step, the defect detection accuracy calculation step and the conclusion determination step are repeated.

摘要翻译： 一种检查缺陷的方法，包括以下步骤：作为图像获取步骤，使用从多个图像获取条件中选择的任意图像获取条件对样本的表面进行成像并获得缺陷图像; 作为缺陷位置计算步骤，进行通过图像获取步骤获得的缺陷图像，并计算样本表面上的缺陷位置; 作为缺陷检测精度计算步骤，获得由缺陷位置计算步骤计算的缺陷位置的缺陷检测精度; 以及作为结论确定步骤，确定由缺陷检测精度计算步骤获得的缺陷检测精度是否满足预定要求; 其中直到确定由缺陷检测精度计算步骤获得的缺陷检测精度在结论确定步骤中达到预定值时，再次从多个图像获取条件中选择图像获取条件，并且图像获取步骤，缺陷 位置计算步骤，重复缺陷检测精度计算步骤和结论确定步骤。

公开(公告)号：US09390490B2

公开(公告)日：2016-07-12

申请号：US13520210

申请日：2010-12-22

申请人： Yuji Takagi ,  Minoru Harada ,  Ryo Nakagaki ,  Naoki Hosoya ,  Toshifumi Honda ,  Takehiro Hirai

发明人： Yuji Takagi ,  Minoru Harada ,  Ryo Nakagaki ,  Naoki Hosoya ,  Toshifumi Honda ,  Takehiro Hirai

IPC分类号： H04N7/18 ,  G06T7/00 ,  H01L21/66

CPC分类号： G06T7/001 ,  G06T2207/10061 ,  G06T2207/20081 ,  G06T2207/30148 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： In performing a programmed-point inspection of a circuit pattern using a review SEM, stable inspection can be performed while suppressing the generation of a false report even when a variation in a circuit pattern to be inspected is large. SEM images that are obtained by sequentially imaging a predetermined circuit pattern using the review SEM are stored into a storage unit. Images that meet a set condition are selected from the stored SEM images, and averaged to create an average image (GP image). By performing pattern check by GP comparison using this GP image, an inspection can be performed while suppressing the generation of a false report even when a variation in the circuit patterns is large.

摘要翻译： 在使用复查SEM执行电路图案的编程点检查时，即使在要检查的电路图案的变化大的情况下，也可以抑制误报的产生而进行稳定的检查。 通过使用评价SEM将预定电路图案顺序成像获得的SEM图像存储在存储单元中。 从存储的SEM图像中选择满足设定条件的图像，并平均以创建平均图像（GP图像）。 通过使用该GP图像通过GP比较进行模式检查，即使当电路图案的变化大时也可以在抑制伪报告的产生的同时执行检查。

公开(公告)号：US09311697B2

公开(公告)日：2016-04-12

申请号：US13639103

申请日：2011-04-01

申请人： Minoru Harada ,  Ryo Nakagaki ,  Takehiro Hirai ,  Naoki Hosoya

发明人： Minoru Harada ,  Ryo Nakagaki ,  Takehiro Hirai ,  Naoki Hosoya

IPC分类号： G06K9/00 ,  G06T7/00 ,  H01L21/66

CPC分类号： G06T7/0004 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed is a method of inspecting an object to be inspected in a semiconductor manufacturing process, for resolving the problem to increase defect detection sensitivity. An image capture means is used to image capture a designated area of the object to be inspected; a defect is detected in the captured image; a circuit pattern is recognized from the captured image; a characteristic value is computed, relating to an image tone and shape, from the detected defect; a characteristic value is computed, relating to the image tone and shape, from the recognized circuit pattern; either a specified defect or circuit pattern is filtered and extracted from the detected defect and the recognized circuit pattern; a mapping characteristic value is determined from the characteristic value of either the filtered and extracted specified defect or circuit pattern; and the distribution of the determined characteristic values is displayed onscreen in a map format.

摘要翻译： 公开了一种在半导体制造过程中检查被检查物体的方法，用于解决问题以增加缺陷检测灵敏度。 图像捕捉装置用于对要检查的对象的指定区域进行图像捕获; 在捕获的图像中检测到缺陷; 从捕获的图像识别电路图案; 从检测到的缺陷中计算与图像色调和形状相关的特征值; 根据识别的电路图案计算与图像色调和形状相关的特征值; 从检测到的缺陷和识别的电路图案中滤出并提取指定的缺陷或电路图案; 根据滤波和提取的指定缺陷或电路图案的特征值确定映射特征值; 并且以映射格式在屏幕上显示所确定的特征值的分布。

公开(公告)号：US20140219546A1

公开(公告)日：2014-08-07

申请号：US14347127

申请日：2012-07-06

申请人： Yohei Minekawa ,  Kenji Nakahira ,  Minoru Harada ,  Takehiro Hirai ,  Ryo Nakagaki

发明人： Yohei Minekawa ,  Kenji Nakahira ,  Minoru Harada ,  Takehiro Hirai ,  Ryo Nakagaki

IPC分类号： G06T7/00

CPC分类号： G06T7/0004 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/20016 ,  G06T2207/30148

摘要： A method for reviewing defect, comprising the steps of: as an image acquisition step, imaging a surface of a sample using arbitrary image acquisition condition selected from a plurality of image acquisition conditions and obtaining a defect image; as a defect position calculation step, proceeding the defect image obtained by the image acquisition step and calculating a defect position on the surface of the sample; as a defect detection accuracy calculation step, obtaining a defect detection accuracy of the defect position calculated by the defect position calculation step; and as a conclusion determination step, determinating whether the defect detection accuracy obtained by the defect detection accuracy calculation step meets a predetermined requirement or not; wherein until it is determined that the defect detection accuracy obtained by the defect detection accuracy calculation step meets a predetermined in the conclusion determination step, the image acquisition condition is selected from the plurality of image acquisition conditions once again and the image acquisition step, the defect position calculation step, the defect detection accuracy calculation step and the conclusion determination step are repeated.

摘要翻译： 一种检查缺陷的方法，包括以下步骤：作为图像获取步骤，使用从多个图像获取条件中选择的任意图像获取条件对样本的表面进行成像并获得缺陷图像; 作为缺陷位置计算步骤，进行通过图像获取步骤获得的缺陷图像，并计算样本表面上的缺陷位置; 作为缺陷检测精度计算步骤，获得由缺陷位置计算步骤计算的缺陷位置的缺陷检测精度; 以及作为结论确定步骤，确定由缺陷检测精度计算步骤获得的缺陷检测精度是否满足预定要求; 其中直到确定由缺陷检测精度计算步骤获得的缺陷检测精度在结论确定步骤中达到预定值时，再次从多个图像获取条件中选择图像获取条件，并且图像获取步骤，缺陷 位置计算步骤，重复缺陷检测精度计算步骤和结论确定步骤。

公开(公告)号：US08526710B2

公开(公告)日：2013-09-03

申请号：US12292173

申请日：2008-11-13

申请人： Ryo Nakagaki ,  Minoru Harada ,  Takehiro Hirai

发明人： Ryo Nakagaki ,  Minoru Harada ,  Takehiro Hirai

IPC分类号： G06K9/00

CPC分类号： G06T7/001 ,  G06T7/0006 ,  G06T2207/10061 ,  G06T2207/30148

摘要： A candidate-defect classification method includes the steps of acquiring a scanning electron microscope (SEM) image of a candidate defect detected in an inspection from a sample including a pattern formed thereon, the inspection being preliminarily performed by an other inspection device; computing a feature value of the candidate defect by processing the SEM image; executing defect classification of the candidate defect as any one of a pattern shape defect and an other defect by using the computed feature value; acquiring positional information contained in design data of the pattern with respect to a candidate defect classified as the pattern shape defect; and extracting a systematic defect from among candidate defects classified as the pattern shape defects by performing a comparison of the positional information contained in the design data of the acquired candidate defect to positional information of a portion that has a high probability of causing a pattern formation failure and that has been obtained from the design data of the pattern, the systematic defect being caused due to a layout shape of the pattern, properties of a processor for forming the pattern, or the like.

公开(公告)号：US20090136121A1

公开(公告)日：2009-05-28

申请号：US12292173

申请日：2008-11-13

申请人： Ryo Nakagaki ,  Minoru Harada ,  Takehiro Hirai

发明人： Ryo Nakagaki ,  Minoru Harada ,  Takehiro Hirai

IPC分类号： G06T7/00

CPC分类号： G06T7/001 ,  G06T7/0006 ,  G06T2207/10061 ,  G06T2207/30148

摘要： A candidate-defect classification method includes the steps of acquiring a scanning electron microscope (SEM) image of a candidate defect detected in an inspection from a sample including a pattern formed thereon, the inspection being preliminarily performed by an other inspection device; computing a feature value of the candidate defect by processing the SEM image; executing defect classification of the candidate defect as any one of a pattern shape defect and an other defect by using the computed feature value; acquiring positional information contained in design data of the pattern with respect to a candidate defect classified as the pattern shape defect; and extracting a systematic defect from among candidate defects classified as the pattern shape defects by performing a comparison of the positional information contained in the design data of the acquired candidate defect to positional information of a portion that has a high probability of causing a pattern formation failure and that has been obtained from the design data of the pattern, the systematic defect being caused due to a layout shape of the pattern, properties of a processor for forming the pattern, or the like.

摘要翻译： 候选缺陷分类方法包括以下步骤：从包括形成在其上的图案的样本中获取在检查中检测到的候选缺陷的扫描电子显微镜（SEM）图像，该检查由另一检查装置预先执行; 通过处理SEM图像来计算候选缺陷的特征值; 通过使用所计算的特征值来执行候选缺陷的缺陷分类作为图案形状缺陷和其他缺陷中的任何一个; 获取包含在所述图案的设计数据中的关于被分类为所述图案形状缺陷的候选缺陷的位置信息; 并且通过将所获取的候选缺陷的设计数据中包含的位置信息与导致图案形成失败的可能性高的部分的位置信息进行比较，从分类为图案形状缺陷的候选缺陷中提取系统缺陷 并且是从图案的设计数据获得的，由于图案的布局形状，用于形成图案的处理器的特性等引起的系统缺陷。

公开(公告)号：US09401015B2

公开(公告)日：2016-07-26

申请号：US14112105

申请日：2012-04-16

申请人： Yohei Minekawa ,  Yuji Takagi ,  Minoru Harada ,  Takehiro Hirai ,  Ryo Nakagaki

发明人： Yohei Minekawa ,  Yuji Takagi ,  Minoru Harada ,  Takehiro Hirai ,  Ryo Nakagaki

IPC分类号： G06K9/00 ,  G06T7/00 ,  G01N23/225 ,  G06K9/62 ,  G06T5/00 ,  G01N21/95 ,  H01L21/66

CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N23/225 ,  G01N2223/421 ,  G01N2223/611 ,  G01N2223/646 ,  G06K9/6267 ,  G06T5/00 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01L22/12 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： In automatic defect classification, a classification recipe must be set for each defect observation device. If a plurality of devices operate at the same stage, the classification class in the classification recipes must be the same. Problems have arisen whereby differences occur in the classification class in different devices when a new classification recipe is created. This defect classification system has a classification recipe storage unit; an information specification unit, the stage of a stored image, and device information. A corresponding defect specification unit specifies images of the same type of defect from images obtained from different image pickup devices at the same stage. An image conversion unit converts the images obtained from the different image pickup devices at the same stage into comparable similar images; and a recipe update unit records the classification classes in the classification recipes corresponding to the specified images of the same type of defect.

摘要翻译： 在自动缺陷分类中，必须为每个缺陷观察装置设定分类处方。 如果多个设备在同一阶段进行操作，则分类配方中的分类等级必须相同。 当创建新的分类配方时，出现了在不同装置中的分类等级中出现差异的问题。 该缺陷分类系统具有分类配方存储单元; 信息指定单元，存储图像的级和设备信息。 相应的缺陷指定单元从在相同阶段从不同图像拾取装置获得的图像中指定相同类型的缺陷的图像。 图像转换单元将从相同阶段的不同图像拾取装置获得的图像转换成可比较的相似图像; 并且配方更新单元将分类类别记录在与相同类型的缺陷的指定图像相对应的分类配方中。

公开(公告)号：US20130222574A1

公开(公告)日：2013-08-29

申请号：US13878256

申请日：2011-10-03

申请人： Ryo Nakagaki ,  Minoru Harada ,  Takehiro Hirai

发明人： Ryo Nakagaki ,  Minoru Harada ,  Takehiro Hirai

IPC分类号： G06T7/00

CPC分类号： G06T7/0004 ,  G06T7/0008 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01L22/12

摘要： In a defect classification system using plural types of observation devices that acquire images having different characteristics, classification performance and operability of the system are improved. The a defect classification system includes plural imaging part that acquire images of an inspection target, a defect classification device that classifies the acquired images acquired by the plural imaging part, and a communication part that transmits data between the plural imaging devices and the defect classification device, in which the defect classification device includes an image storage part that stores the acquired image data acquired by the plural imaging part, an information storage part that stores associated information about the input image data, and a part for changing a processing method or a display method depending on the associated information.

摘要翻译： 在采用获取具有不同特征的图像的多种观察装置的缺陷分类系统中，提高了系统的分类性能和可操作性。 缺陷分类系统包括获取检查对象的图像的多个成像部，对由多个成像部获取的获取图像进行分类的缺陷分类装置，以及在多个成像装置与缺陷分类装置之间发送数据的通信部 ，其中所述缺陷分类装置包括存储由所述多个成像部分获取​​的获取的图像数据的图像存储部分，存储关于输入图像数据的相关信息的信息存储部分，以及用于改变处理方法或显示的部分 方法取决于相关信息。

公开(公告)号：US20130070078A1

公开(公告)日：2013-03-21

申请号：US13520210

申请日：2010-12-22

申请人： Yuji Takagi ,  Minoru Harada ,  Ryo Nakagaki ,  Naoki Hosoya ,  Toshifumi Honda ,  Takehiro Hirai

发明人： Yuji Takagi ,  Minoru Harada ,  Ryo Nakagaki ,  Naoki Hosoya ,  Toshifumi Honda ,  Takehiro Hirai

IPC分类号： H04N7/18

CPC分类号： G06T7/001 ,  G06T2207/10061 ,  G06T2207/20081 ,  G06T2207/30148 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： In performing a programmed-point inspection of a circuit pattern using a review SEM, stable inspection can be performed while suppressing the generation of a false report even when a variation in a circuit pattern to be inspected is large. SEM images that are obtained by sequentially imaging a predetermined circuit pattern using the review SEM are stored into a storage unit. Images that meet a set condition are selected from the stored SEM images, and averaged to create an average image (GP image). By performing pattern check by GP comparison using this GP image, an inspection can be performed while suppressing the generation of a false report even when a variation in the circuit patterns is large.

摘要翻译： 在使用复查SEM执行电路图案的编程点检查时，即使在要检查的电路图案的变化大的情况下，也可以抑制误报的产生而进行稳定的检查。 通过使用评价SEM将预定电路图案顺序成像获得的SEM图像存储在存储单元中。 从存储的SEM图像中选择满足设定条件的图像，并平均以创建平均图像（GP图像）。 通过使用该GP图像通过GP比较进行模式检查，即使当电路图案的变化大时也可以在抑制伪报告的产生的同时执行检查。

公开(公告)号：US20120257041A1

公开(公告)日：2012-10-11

申请号：US13513258

申请日：2010-11-22

申请人： Ryo Nakagaki ,  Minoru Harada ,  Takehiro Hirai ,  Yuji Takagi

发明人： Ryo Nakagaki ,  Minoru Harada ,  Takehiro Hirai ,  Yuji Takagi

IPC分类号： H04N7/18

CPC分类号： H01J37/28 ,  H01J2237/24592 ,  H01J2237/2817 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided is a technique for a wafer inspection conducted by simple operation, which is useful even when the inspection covers a variety of items and the inspection items are changed frequently with time like in a start-up period of a semi-conductor process. According to the technique, inspection images are collected, and then a template is prepared from the inspection images. A plurality of regions are defined on the template, and inspection methods and output indexes are registered in correspondence with the respective regions. In the inspection, by reference to the template images corresponding to the derived inspection images, the inspection is conducted based on the inspection information registered therein and the quantitative output levels are calculated.

摘要翻译： 提供了一种通过简单的操作进行的晶片检查的技术，即使在检查覆盖各种物品并且检查项目在半导体处理的启动期间随时间频繁地变化也是有用的。 根据该技术，收集检查图像，然后从检查图像准备模板。 在模板上定义多个区域，并且与各个区域对应地登记检查方法和输出索引。 在检查中，参考与导出的检查图像对应的模板图像，基于登记在其中的检查信息进行检查，并计算定量输出水平。