-
公开(公告)号：US12133369B2
公开(公告)日：2024-10-29
申请号：US17916854
申请日：2021-05-19
发明人： Yuta Yoshimi , Kenta Fujii , Yuji Shirakata , Hiroyuki Yahara , Hiroyuki Kiyonaga , Tomohito Fukuda
CPC分类号： H05K7/209 , H02M3/003 , H02M3/33569 , H05K1/181 , H02M3/285 , H02M3/33573 , H05K1/148 , H05K3/366
摘要： A power conversion device includes an electronic component, a first printed circuit board, a first cooling body, a second printed circuit board, a second cooling body, and a first wiring member. The power conversion device further includes a first insulating member. On a first main surface of the first printed circuit board, a first joint portion to which the first wiring member is joined is provided. Between a second main surface of the first printed circuit board and the first cooling body, the first insulating member is arranged on a rear surface of at least the first joint portion.
-
公开(公告)号：US11350517B2
公开(公告)日：2022-05-31
申请号：US16963294
申请日：2019-01-18
发明人： Hiroyuki Yahara , Kenta Fujii , Yuji Shirakata , Tomohito Fukuda , Takashi Kumagai , Koji Nakajima
摘要： A circuit device capable of significantly improving heat dissipation performance of a printed circuit board without increasing the size includes a printed circuit board, a mounted component, a non-solid metal spacer, a cooler, and a resin layer. The mounted component is at least partially disposed on at least one main surface of printed circuit board. The non-solid metal spacer is disposed at least on one main surface of the printed circuit board. The cooler is disposed at the non-solid metal spacer on the opposite side to the printed circuit board. The resin layer is disposed between the non-solid metal spacer and the cooler. The non-solid metal spacer has a shape that allows at least one hollow portion to be formed between the printed circuit board and the cooler.
-
搜索结果
2 条记录 (耗时 0.014 秒)
