公开(公告)号：US20220344893A1

公开(公告)日：2022-10-27

申请号：US17641164

申请日：2019-12-04

申请人： Mitsubishi Electric Corporation

发明人： Chikara WATATANI ,  Motoharu MIYASHITA ,  Takehiro NISHIDA

IPC分类号： H01S5/0237 ,  H01S5/0234 ,  H01S5/22 ,  H01S5/042

摘要： Provided here are: semiconductor layers comprised of an n-type cladding layer formed on a surface of an n-type GaAs substrate, active layers formed on surfaces of the n-type cladding layer, p-type cladding layers formed on surfaces of the active layers, and p-type contact layers formed on surfaces of the p-type cladding layers, the p-type cladding layers and the p-type contact layers being formed to have a ridges; insulating films covering surfaces of the semiconductor layers but having openings on surfaces of the p-type contact layer; and conductive layers connected to the p-type contact layers through the openings, the conductive layers being formed on surfaces of the insulating films to cover planar portions provided in the semiconductor layers adjacently to the ridges; wherein, together with the conductive layers, convex sidewalls are provided to be placed over portions of the planar portions at their sides nearer to the ridges.

公开(公告)号：US20220037851A1

公开(公告)日：2022-02-03

申请号：US17280360

申请日：2019-01-10

申请人： Mitsubishi Electric Corporation

发明人： Yuji IWAI ,  Motoharu MIYASHITA ,  Kyosuke KURAMOTO

IPC分类号： H01S5/0237 ,  H01S5/02315 ,  H01S5/024

摘要： A semiconductor laser device is configured so that, on at least one of the respective opposing surfaces of a semiconductor laser chip and a sub-mount and the respective opposing surfaces of the sub-mount and a heatsink, one or more treatment regions are provided where adhesion of a bonding material or bonding material used for their bonding is reduced, wherein the one or more treatment regions are placed to define, in a traveling direction of light, different coverages depending on a position in an array direction of multiple light emitting regions.