公开(公告)号：US10418295B2

公开(公告)日：2019-09-17

申请号：US16061019

申请日：2016-11-04

申请人： Mitsubishi Electric Corporation

发明人： Yoshinori Yokoyama ,  Shinnosuke Soda ,  Narihito Ota ,  Kazuyasu Nishikawa ,  Akihisa Fukumoto

IPC分类号： H01L23/13 ,  H01L23/12 ,  H01L23/373 ,  H01L23/36 ,  H01L23/40 ,  H01L23/00 ,  H01L29/739

摘要： A power module includes an insulated circuit board, a semiconductor element, a first buffer plate, and first and second joining materials. The semiconductor element is disposed on a side of one main surface of the insulated circuit board. The first buffer plate is disposed between the insulated circuit board and the semiconductor element. The first joining material is divided into a plurality of portions in a plan view. The first buffer plate is higher in coefficient of linear expansion than the semiconductor element and lower in coefficient of linear expansion than the insulated circuit board. The first buffer plate is lower in Young's modulus than the semiconductor element.