公开(公告)号：US12238861B2

公开(公告)日：2025-02-25

申请号：US18688376

申请日：2022-09-14

Applicant: Mitsubishi Electric Corporation

Inventor： Tatsuya Sakamoto ,  Kenjiro Takanishi ,  Hitoshi Arai ,  Hiroshi Goto ,  Akihito Hirai

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/42 ,  H05K3/46

Abstract: A composite printed wiring board includes a first printed wiring board, a second printed wiring board, an intermediate plate, a first bonding layer, and a second bonding layer. The intermediate plate is provided to surround a space. The first printed wiring board closes one side of the space and is bonded to the intermediate plate. The second printed wiring board closes the other side of the space and is bonded to the intermediate plate. At least any of the first printed wiring board and the second printed wiring board has a through hole. A cavity is provided that is the space surrounded by the first printed wiring board, the second printed wiring board, the intermediate plate, the first bonding layer, and the second bonding layer. The through hole in communication with the cavity.

公开(公告)号：US11785718B2

公开(公告)日：2023-10-10

申请号：US17429353

申请日：2020-03-26

Applicant: Mitsubishi Electric Corporation

Inventor： Takamichi Kono ,  Hitoshi Arai ,  Tatsuya Sakamoto

IPC: H05K1/14 ,  H05K3/36 ,  H05K3/46

CPC classification number: H05K1/144 ,  H05K3/368 ,  H05K3/4644 ,  H05K2201/042

Abstract: A composite printed wiring board that allows for reflow heating for mounting electronic components using solder includes a first printed wiring board, an intermediate member, a second printed wiring board, and a bonding layer. The intermediate member is stacked on the first printed wiring board. The intermediate member has a cavity. The second printed wiring board is stacked on a surface on the opposite side to a surface opposed to the first printed wiring board in the intermediate member. The bonding layer is arranged at a bonding section between the first printed wiring board and the intermediate member and at a bonding section between the second printed wiring board and the intermediate member. The bonding layer contains high melting point metal and low melting point metal. The melting point of the bonding layer is higher than the melting point of the low melting point metal.

公开(公告)号：USD1028951S1

公开(公告)日：2024-05-28

申请号：US29822520

申请日：2022-01-10

Applicant: Mitsubishi Electric Corporation

Designer： Kei Yokokawa ,  Narihiro Nakamoto ,  Toru Fukasawa ,  Hitoshi Arai ,  Tomohiro Takahashi ,  Kensuke Iwaki ,  Takamichi Kono ,  Keisuke Fujiwara ,  Kenjiro Takanishi ,  Tatsuya Sakamoto ,  Naoya Noguchi

Abstract: FIG. 1 is a perspective view of an antenna showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a top plan view thereof; a bottom view being a minor image;
FIG. 5 is a right side view thereof; a left side view being a minor image;
FIG. 6 is an enlarged view of 6-6 part shown in FIG. 2 thereof;
FIG. 7 is an enlarged view of 7-7 part shown in FIG. 3 thereof;
FIG. 8 is an end view of cutting part at 8-8 of FIG. 6 thereof; and,
FIG. 9 is an enlarged view of 9-9 part shown in FIG. 8 thereof.
The broken lines shown represent portions of the antenna and form no part of the claimed design.
The dot-dash broken lines illustrate a boundary of the claimed design and form no part of the claimed design.