公开(公告)号：US10323133B2

公开(公告)日：2019-06-18

申请号：US15509027

申请日：2015-09-08

申请人： Mitsubishi Rayon Co., Ltd.

发明人： Koichi Akiyama ,  Yuji Kazehaya ,  Mitsushi Nishimura ,  Shinichiro Furuya

IPC分类号： C08J5/24 ,  C08J5/04 ,  B29C70/50 ,  B29C70/46 ,  B29K33/00 ,  B29K105/08 ,  B29K307/04

摘要： The present invention relates to a molding material, having: (A): a fiber substrate made of carbon fibers 5 mm or longer; (B): at least either an epoxy (meth)acrylate resin or an unsaturated polyester resin; (C): (C-1) inorganic fibrous filler with a cross-sectional area of at least 0.8 μm2, or (C-2) inorganic flaky filler with a cross-sectional area of at least 0.05 μm2, both of which have an aspect ratio of 2.0 or higher and a length of less than 3 mm; and (D): a polyisocyanate compound.