公开(公告)号：US06861732B2

公开(公告)日：2005-03-01

申请号：US10333133

申请日：2002-05-17

申请人： Mitsuho Tsuchida ,  Madoka Nishikawa ,  Kenji Ikeda

发明人： Mitsuho Tsuchida ,  Madoka Nishikawa ,  Kenji Ikeda

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L23/49562 ,  H01L24/48 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a conventional power circuit device, such as a power MOSFET monolithic integrated circuit device and a compound device, since five lead pins are lead out from the packaging with even intervals, sufficient separation distances between the third pin of a high voltage and other adjacent pins cannot be secured. According to this invention, the distances between the third pin and other adjacent pins are expanded so as to become wider than the distances between other pins. Furthermore, the third pin is formed into an upper position, its adjacent pins are formed into a lower position, and other pins are formed into a middle position. Thereby, sufficient separation distances between the third pin of the high voltage and other adjacent pins can be secured. Therefore, a structure favorable in terms of safety can be provided. Furthermore, by providing a full-mold packaging, the header portion is not exposed to assure an easy handling.

摘要翻译： 在诸如功率MOSFET单片集成电路器件和复合器件的常规功率电路器件中，由于五个引线引脚以均匀间隔从封装引出，所以高电压的第三引脚与其它相邻引脚之间的足够的间隔距离 无法保证。 根据本发明，第三销和其他相邻销之间的距离被扩大以变得比其他销之间的距离更宽。 此外，第三销形成为上部位置，其相邻的销形成为下部位置，而另一个销形成中间位置。 从而可以确保高电压的第三引脚与其它相邻引脚之间的足够的间隔距离。 因此，可以提供有利于安全性的结构。 此外，通过提供全模包装，头部不暴露以确保易于处理。