摘要:
The present invention assesses memory (DIMM) strength by calculating frequency content of a radiated field which is collected by an apparatus, such as a dipole antenna. Radiated field is created by accelerated charge, which is a function of the slew rate or DIMM strength. Radiated power is directly proportional to the frequency at which bits are driven. By separating the radiated field from the near field or stored field, the DIMM strength content is isolated from other functional DIMM issues, such as tRCD latency, refresh cycles, addressing mode, etc. By examining the radiated power, the disadvantages of the prior art, such as by probing the DIMM's contacts, are avoided.
摘要:
The present invention assesses memory (DIMM) strength by calculating frequency content of a radiated field which is collected by an apparatus, such as a dipole antenna. Radiated field is created by accelerated charge, which is a function of the slew rate or DIMM strength. Radiated power is directly proportional to the frequency at which bits are driven. By separating the radiated field from the near field or stored field, the DIMM strength content is isolated from other functional DIMM issues, such as tRCD latency, refresh cycles, addressing mode, etc. By examining the radiated power, the disadvantages of the prior art, such as by probing the DIMM's contacts, are avoided.
摘要:
An apparatus, system, and method are disclosed for dynamic phase equalization in a communication channel. A transmitter history module stores a plurality of bits from a data stream that is transmitted through the communication channel. A transmitter detection module detects a pre-transition bit of a first value that is preceded in the data stream by at least one bit of the first value and followed by a transition bit with a second value. A driver module transmits the data stream by driving the communication channel. A transition module pre-drives the communication channel to the second voltage of the transition bit during a bit time interval of the pre-transition bit.
摘要:
The invention is directed to an on-chip probing apparatus. In accordance with an embodiment of the present invention, the on-chip probing apparatus includes: a plurality of switches on a chip; a plurality of externally accessible probe points on the chip; and a multiplexer for controlling the plurality of switches to selectively couple an output signal of the chip to one of the plurality of probe points.
摘要:
Embodiments of the present invention address deficiencies of the art in respect to via structure utilization in a PCB design and provide a novel and non-obvious method, system and computer program product for impedance discontinuity remediation for via stubs and connectors in a PCB. In one embodiment a method for impedance discontinuity remediation in a PCB can be provided. The method can include configuring a pre-distortion filter to negate an impedance discontinuity in an electrical signal caused by a transmission line with one of a via stub or a connector. The method further can include pre-distortion filtering an electrical signal before transmitting the electrical signal over the transmission line. Finally, the method can include transmitting the pre-distortion filtered electrical signal over the transmission line.
摘要:
An apparatus, system, and method are disclosed for dynamic phase equalization in a communication channel. A transmitter history module stores a plurality of bits from a data stream that is transmitted through the communication channel. A transmitter detection module detects a pre-transition bit of a first value that is preceded in the data stream by at least one bit of the first value and followed by a transition bit with a second value. A driver module transmits the data stream by driving the communication channel. A transition module pre-drives the communication channel to the second voltage of the transition bit during a bit time interval of the pre-transition bit.
摘要:
Embodiments of the present invention address deficiencies of the art in respect to via structure utilization in a PCB design and provide a novel and non-obvious method, system and computer program product for impedance discontinuity remediation for via stubs and connectors in a PCB. In one embodiment a method for impedance discontinuity remediation in a PCB can be provided. The method can include configuring a pre-distortion filter to negate an impedance discontinuity in an electrical signal caused by a transmission line with one of a via stub or a connector. The method further can include pre-distortion filtering an electrical signal before transmitting the electrical signal over the transmission line. Finally, the method can include transmitting the pre-distortion filtered electrical signal over the transmission line.
摘要:
Embodiments of the present invention address deficiencies of the art in respect to via structure utilization in a PCB design and provide a novel and non-obvious method, system and computer program product for impedance discontinuity remediation for via stubs and connectors in a PCB. In one embodiment a method for impedance discontinuity remediation in a PCB can be provided. The method can include configuring a pre-distortion filter to negate an impedance discontinuity in an electrical signal caused by a transmission line with one of a via stub or a connector. The method further can include pre-distortion filtering an electrical signal before transmitting the electrical signal over the transmission line. Finally, the method can include transmitting the pre-distortion filtered electrical signal over the transmission line.
摘要:
The invention is directed to an on-chip probing apparatus. In accordance with an embodiment of the present invention, the on-chip probing apparatus includes: a plurality of switches on a chip; a plurality of externally accessible probe points on the chip; and a multiplexer for controlling the plurality of switches to selectively couple an output signal of the chip to one of the plurality of probe points.
摘要:
A design structure embodied in a machine readable storage medium for designing, manufacturing, and/or testing a memory module system and DIMM connector is provided. A DIMM connector includes a plurality of DIMM sockets for receiving a corresponding plurality of DIMMs in a radially oriented, angularly spaced orientation. The DIMM sockets are connected in parallel at a memory module junction so that socket terminals of each DIMM socket are joined to the same relative terminal of all the other DIMM sockets along electronic pathways of substantially equal length. A memory controller selectively communicates with the DIMMs via the DIMM junction. By virtue of the improved topology, impedance within the DIMM connector may be better matched to minimize reflections and improve signal quality.