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公开(公告)号：US20080252394A1
公开(公告)日：2008-10-16
申请号：US12103814
申请日：2008-04-16
申请人： Motoyuki TAJIMA , Toshio Nishizawa , Osamu Ikata
发明人： Motoyuki TAJIMA , Toshio Nishizawa , Osamu Ikata
IPC分类号： H03H9/25 , H01L41/187 , H03H9/72
CPC分类号： H03H9/02559 , H03H9/02574 , H03H9/02866 , H03H9/6483
摘要： A surface acoustic wave device includes a supporting substrate, a LiTaO3 piezoelectric substrate joined on the supporting substrate, which has a normal line direction on a main surface thereof in a direction rotated 43° to 53° from a Y axis to a Z axis direction about an X axis, and an electrode pattern formed on the piezoelectric substrate.
摘要翻译： 表面声波装置包括支撑基板，连接在支撑基板上的LiTaO3压电基板，该基板在其主表面上沿从Y轴向Z轴方向旋转43°至53°的方向具有法线方向 X轴，以及形成在压电基板上的电极图案。
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公开(公告)号：US20130106530A1
公开(公告)日：2013-05-02
申请号：US13616265
申请日：2012-09-14
CPC分类号： H03H9/0571 , H03H9/0576 , H03H9/1014 , H03H9/1042 , H03H9/1071 , H03H9/1085
摘要： An acoustic wave device includes: a multilayer structure that has plural surfaces which principal surfaces of plural layers provide; a chip including an acoustic wave filter and mounted on a first surface; a resin unit sealing the chip; a wiring pattern that is formed on a second surface and electrically connected to at least one of resonators; a ground pattern that is formed on the second surface along a part of the wiring pattern, and is away from the wiring pattern; and an external terminal that is formed on a third surface and electrically connected to the wiring pattern and the ground pattern, the third surface being disposed on an opposite side of the first surface with respect to the second surface; wherein a part of the wiring pattern that comes closest to the ground pattern is substantially formed in parallel with the ground pattern.
摘要翻译： 声波装置包括：多层结构，其具有多层提供的主表面的多个表面; 包括声波滤波器并安装在第一表面上的芯片; 密封芯片的树脂单元; 形成在第二表面上并与至少一个谐振器电连接的布线图案; 沿着所述布线图形的一部分形成在所述第二表面上并且远离所述布线图案的接地图案; 以及外部端子，其形成在第三表面上并且电连接到所述布线图案和所述接地图案，所述第三表面相对于所述第二表面设置在所述第一表面的相对侧上; 其中最靠近接地图案的布线图案的一部分基本上与接地图形平行地形成。
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