Lift-off process for patterning fine metal lines
    2.
    发明授权
    Lift-off process for patterning fine metal lines 有权
    图案精细金属线的剥离工艺

    公开(公告)号:US06372414B1

    公开(公告)日:2002-04-16

    申请号:US09268438

    申请日:1999-03-12

    IPC分类号: G03F726

    CPC分类号: G03F7/322 G03F7/168 G03F7/38

    摘要: The present invention relates to a process for providing a pattern on a substrate for use in a metal lift-off process, the process comprising: 1) coating a substrate with a liquid positive photoresist; 2) soft baking the coated substrate; 3) contacting the substrate with an aqueous alkaline developer containing from about 0.005 volume percent to about 0.05 volume percent of an alkylene glycol alkyl ether; 4) placing a patterned mask over the substrate; 5) exposing the substrate through the mask; 6) post exposure baking the substrate; 7) optionally, flood exposing the substrate; and 8) developing the substrate with an aqueous alkaline developer. The invention also relates to a novel developer solution of an ammonium hydroxide containing from about 0.005 volume percent to about 0.5 volume percent of an alkylene glycol alkyl ether and to a process for producing such a novel developer solution.

    摘要翻译: 本发明涉及在用于金属剥离工艺的基板上提供图案的方法,该方法包括:1)用液体正性光致抗蚀剂涂覆基材; 2)软化涂层基材; 3)使底物与含有约0.005体积%至约0.05体积%的亚烷基二醇烷基醚的含水碱性显影剂接触; 4)将图案化掩模放置在衬底上; 5)使基板通过掩模曝光; 6)曝光后烘烤基材; 7)任选地,泛化暴露基板; 和8)用含水碱性显影剂显影底物。 本发明还涉及含有约0.005体积%至约0.5体积%的亚烷基二醇烷基醚的氢氧化铵的新显影剂溶液以及用于制备这种新型显影剂溶液的方法。