公开(公告)号：US20130077262A1

公开(公告)日：2013-03-28

申请号：US13684608

申请日：2012-11-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Issei YAMAMOTO ,  Akihiko KAMADA

IPC: H05K3/46 ,  H05K1/14

CPC classification number: H05K3/4697 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/141 ,  H05K1/145 ,  H05K1/182 ,  H05K1/186 ,  H05K3/284 ,  H05K3/4629 ,  H05K2201/049 ,  H05K2203/1316 ,  Y10T29/49126

Abstract: In a method of manufacturing a module board, an electronic component is mounted on a first principal surface of a small board. A cavity defining a through hole is formed in a core board. The electronic component is housed in the cavity by mounting the small board on a surface electrode arranged around the cavity. Resin layers are formed on both principal surfaces of the core board, and resin flows through a gap between the core board and the small board. Hence, the inside of the cavity is filled with the resin, and the electronic component is sealed with the resin.

Abstract translation: 在制造模块板的方法中，电子部件安装在小板的第一主表面上。 在芯板中形成限定通孔的空腔。 通过将小板安装在布置在腔体周围的表面电极上，将电子部件容纳在腔中。 树脂层形成在芯板的两个主表面上，并且树脂流过芯板和小板之间的间隙。 因此，空腔的内部填充有树脂，电子部件用树脂密封。