公开(公告)号：US20170294264A1

公开(公告)日：2017-10-12

申请号：US15470254

申请日：2017-03-27

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Ryota HASHIMOTO ,  Atsuyoshi MAEDA ,  Chihiro YAMAGUCHI ,  Hiroyuki TEI ,  Kohei KOBAYASHI

IPC: H01F27/28 ,  H01F27/29

Abstract: First and second wires form a wire assembly by being wound around a winding core portion together. The wire assembly includes a twisted wire portion, an inner layer portion, an outer layer portion, a plurality of outward transition portions, and an inward transition portion. The outer layer portion includes a first outer layer portion which is connected to one of the outward transition portions extending from an intermediate position of the inner layer portion and connected to the inward transition portion. The inward transition portion extends to an intermediate position of the inner layer portion.

公开(公告)号：US20250166882A1

公开(公告)日：2025-05-22

申请号：US19034054

申请日：2025-01-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryota HASHIMOTO ,  Atsuyoshi MAEDA ,  Chihiro YAMAGUCHI ,  Hiroyuki TEI ,  Kohei KOBAYASHI

IPC: H01F27/28 ,  H01F27/29

Abstract: First and second wires form a wire assembly by being wound around a winding core portion together. The wire assembly includes a twisted wire portion, an inner layer portion, an outer layer portion, a plurality of outward transition portions, and an inward transition portion. The outer layer portion includes a first outer layer portion which is connected to one of the outward transition portions extending from an intermediate position of the inner layer portion and connected to the inward transition portion. The inward transition portion extends to an intermediate position of the inner layer portion.

公开(公告)号：US20240055175A1

公开(公告)日：2024-02-15

申请号：US18494529

申请日：2023-10-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryota HASHIMOTO ,  Atsuyoshi MAEDA ,  Chihiro YAMAGUCHI ,  Hiroyuki TEI ,  Kohei KOBAYASHI

IPC: H01F27/28 ,  H01F27/29

CPC classification number: H01F27/2823 ,  H01F27/29

Abstract: First and second wires form a wire assembly by being wound around a winding core portion together. The wire assembly includes a twisted wire portion, an inner layer portion, an outer layer portion, a plurality of outward transition portions, and an inward transition portion. The outer layer portion includes a first outer layer portion which is connected to one of the outward transition portions extending from an intermediate position of the inner layer portion and connected to the inward transition portion. The inward transition portion extends to an intermediate position of the inner layer portion.

公开(公告)号：US20210265101A1

公开(公告)日：2021-08-26

申请号：US17318722

申请日：2021-05-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryota HASHIMOTO ,  Atsuyoshi MAEDA ,  Chihiro YAMAGUCHI ,  Hiroyuki TEI ,  Kohei KOBAYASHI

IPC: H01F27/28 ,  H01F27/29

Abstract: First and second wires form a wire assembly by being wound around a winding core portion together. The wire assembly includes a twisted wire portion, an inner layer portion, an outer layer portion, a plurality of outward transition portions, and an inward transition portion. The outer layer portion includes a first outer layer portion which is connected to one of the outward transition portions extending from an intermediate position of the inner layer portion and connected to the inward transition portion. The inward transition portion extends to an intermediate position of the inner layer portion.

公开(公告)号：US20130083502A1

公开(公告)日：2013-04-04

申请号：US13689794

申请日：2012-11-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Atsuyoshi MAEDA ,  Shingo ITO ,  Satoru NODA

IPC: H05K7/02

CPC classification number: H05K7/026 ,  H01G4/232 ,  H01G4/40 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5389 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/19106 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A package substrate includes a main package body including a first principal surface on which an IC is mounted, and a second principal surface, opposed to the first principal surface, on which first bonding materials for mounting are provided. An internal circuit is provided within the main package body and connected to the first bonding materials. A sub-package is arranged on the second principal surface and includes electronic components embedded therein. A thickness direction dimension being the distance from the second principal surface to a portion of the sub-package most distant from the second principal surface, is not more than a thickness direction dimension being the distance from the second principal surface to an edge of the first bonding material at the second principal surface.

Abstract translation: 封装基板包括：主封装主体，包括安装有IC的第一主表面;以及与第一主表面相对的第二主表面，在其上设置用于安装的第一粘合材料。 内部电路设置在主包装体内并连接到第一接合材料。 子包装被布置在第二主表面上并且包括嵌入其中的电子部件。 厚度方向尺寸是从第二主表面到最远离第二主表面的子组件的一部分的距离的厚度方向尺寸不大于从第二主表面到第一主表面的边缘的距离的厚度方向尺寸 在第二主表面处接合材料。