公开(公告)号：US20240312856A1

公开(公告)日：2024-09-19

申请号：US18674230

申请日：2024-05-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroki YOSHIMORI ,  Tsuyoshi TAKAKURA ,  Daisuke KINO ,  Hideo NAKAGOSHI ,  Takamitsu NAKAMURA

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L25/16

CPC classification number: H01L23/3107 ,  H01L21/565 ,  H01L24/16 ,  H01L24/81 ,  H01L25/16 ,  H01L23/49822 ,  H01L2224/16013 ,  H01L2224/16014 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81005 ,  H01L2224/81815 ,  H01L2924/3512

Abstract: An electronic component package includes an electronic component and a sealing resin sealing the electronic component. In the electronic component package, one of main surfaces of the sealing resin defines a mounting surface used for mounting the electronic component package on a different substrate, and in a view of the mounting surface of the sealing resin, a land electrically connected to an electrode of an electronic component and a conductor made of solder or an alloy phase between the solder and another metal and surrounding at least a portion of an outer circumference of the land are exposed on the mounting surface.