公开(公告)号：US20240389234A1

公开(公告)日：2024-11-21

申请号：US18790339

申请日：2024-07-31

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Tsuyoshi TAKAKURA ,  Hiroki YOSHIMORI ,  Hideo NAKAGOSHI

IPC: H05K1/14

Abstract: In a circuit module of the present disclosure, one or more solder balls have an ellipsoidal shape, are located in an inter-board region between an upper circuit board and a lower circuit board, and electrically connect the upper circuit board and the lower circuit board. The size of the second solder ball is larger than the size of the first solder ball. A first sealing resin is provided in the inter-board region so as to be in contact with a first lower main surface and a second upper main surface and to cover surfaces of the one or more second solder balls.

公开(公告)号：US20240203902A1

公开(公告)日：2024-06-20

申请号：US18588564

申请日：2024-02-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Tsuyoshi TAKAKURA

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/48227

Abstract: A module includes: one or more electronic components and one or more pad electrodes disposed and aligned such that lower ends thereof are positioned on a reference surface; and a sealing resin disposed to seal the one or more pad electrodes and the one or more electronic components. A first surface serving as an upper surface and a second surface serving as a side surface of the sealing resin are covered with a shield film. A first wire and a second wire are disposed in the sealing resin to electrically connect the one or more pad electrodes and the shield film at a first point and a second point, respectively, that are selected from the first surface and the second surface. The first point and the second point are different in height when viewed from the reference surface.

公开(公告)号：US20230260929A1

公开(公告)日：2023-08-17

申请号：US18301322

申请日：2023-04-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Ryoichi KITA ,  Tsuyoshi TAKAKURA

IPC: H01L23/552 ,  H01L25/16

CPC classification number: H01L23/552 ,  H01L25/16

Abstract: An electronic component module includes a substrate, a plurality of electronic components, an insulating sealing resin, a conductive film, and a conductive chip component. The plurality of electronic components includes an electronic component having a grounding terminal at a side end portion, and are mounted on the main surface of the substrate. The sealing resin covers the plurality of electronic components and the main surface side of the substrate. The conductive film covers the outer surface of the sealing resin. The conductive chip component is disposed on a side of the electronic component opposite to the substrate in a normal direction of the main surface, and is connected to a grounding terminal of the electronic component. The conductive film is connected to the conductive chip component.

公开(公告)号：US20200343151A1

公开(公告)日：2020-10-29

申请号：US16923211

申请日：2020-07-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadashi NOMURA ,  Shinichiro BANBA ,  Tsuyoshi TAKAKURA

IPC: H01L23/12 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/552 ,  H01L25/04 ,  H01L25/16

Abstract: A module includes components on an upper surface and a lower surface of a substrate, a second sealing resin layer laminated on the upper surface of the substrate, a first sealing resin layer on the lower surface of the substrate, and terminal blocks on the lower surface of the substrate. Each of the terminal blocks is formed by integrating a plurality of connection conductors, each of the plurality of connection conductors including a terminal portion and a substrate connecting portion formed by bending an end portion of the connection conductor, and each of the terminal blocks forms an external connection terminal of the module or functions as a shield wall for the components. Each of the terminal blocks 6 can be formed by mounting a terminal assembly onto the lower surface of the substrate, sealing the terminal assembly with a resin, and removing connecting portions.

公开(公告)号：US20240284591A1

公开(公告)日：2024-08-22

申请号：US18650918

申请日：2024-04-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tsuyoshi TAKAKURA ,  Masaaki MIZUSHIRO ,  Satoshi IZUMI ,  Ryuichiro WADA ,  Hiroki YOSHIMORI ,  Yoshihito OTSUBO ,  Tadashi NOMURA

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2201/0367 ,  H05K2201/0391

Abstract: A circuit module includes: a substrate including a first main surface and a second main surface; a resin layer on the first main surface of the substrate; an electronic component; a penetrating portion penetrating the resin layer in a thickness direction; a first conductor that is a pillar conductor present in the penetrating portion, the first conductor including a first bottom closer to the substrate and a second bottom inward of an outer surface of the resin layer; a second conductor that is a metal film covering at least a portion of a side surface of the first conductor, the second conductor including a portion extending continuously from the side surface of the first conductor to the same plane with the outer surface of the resin layer.

公开(公告)号：US20230309230A1

公开(公告)日：2023-09-28

申请号：US18298451

申请日：2023-04-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tsuyoshi TAKAKURA ,  Yoshihito OTSUBO ,  Tadashi NOMURA ,  Hideo NAKAGOSHI

IPC: H05K1/18 ,  H01L25/16 ,  H01L23/552 ,  H05K9/00 ,  H01L25/00 ,  H01L25/065 ,  H05K3/34 ,  H05K3/32

CPC classification number: H05K1/18 ,  H01L23/552 ,  H01L25/0657 ,  H01L25/162 ,  H01L25/50 ,  H05K3/321 ,  H05K3/34 ,  H05K9/0022 ,  H01L24/16 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/1053

Abstract: The present disclosure is directed to an electronic component module including: a substrate; an electronic component mounted on the substrate; and a sub-module mounted on the substrate, the sub-module including a wiring board, a first electronic component disposed on one of two main surfaces of the wiring board, a second electronic component disposed on the other of the two main surfaces of the wiring board, and a first sealing member that covers the wiring board, the first electronic component, and the second electronic component.

公开(公告)号：US20240312856A1

公开(公告)日：2024-09-19

申请号：US18674230

申请日：2024-05-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroki YOSHIMORI ,  Tsuyoshi TAKAKURA ,  Daisuke KINO ,  Hideo NAKAGOSHI ,  Takamitsu NAKAMURA

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L25/16

CPC classification number: H01L23/3107 ,  H01L21/565 ,  H01L24/16 ,  H01L24/81 ,  H01L25/16 ,  H01L23/49822 ,  H01L2224/16013 ,  H01L2224/16014 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81005 ,  H01L2224/81815 ,  H01L2924/3512

Abstract: An electronic component package includes an electronic component and a sealing resin sealing the electronic component. In the electronic component package, one of main surfaces of the sealing resin defines a mounting surface used for mounting the electronic component package on a different substrate, and in a view of the mounting surface of the sealing resin, a land electrically connected to an electrode of an electronic component and a conductor made of solder or an alloy phase between the solder and another metal and surrounding at least a portion of an outer circumference of the land are exposed on the mounting surface.

公开(公告)号：US20230230951A1

公开(公告)日：2023-07-20

申请号：US18189500

申请日：2023-03-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Morio TAKEUCHI ,  Tsuyoshi TAKAKURA

IPC: H01L23/00 ,  H01L21/60 ,  H01L23/552 ,  H01L23/66 ,  H01L23/538

CPC classification number: H01L24/48 ,  H01L21/60 ,  H01L23/552 ,  H01L23/66 ,  H01L23/5386 ,  H01L2224/48227 ,  H01L2224/4912 ,  H01L24/49 ,  H01L2924/19101 ,  H01L2924/3025

Abstract: To provide a circuit module capable of suppressing a decrease in an area for mounting an electronic component on a substrate even when a wire for shielding the electronic component is connected to the substrate. A circuit module according to the present disclosure includes a substrate, a first component mounted on the substrate and including a ground terminal on an upper surface, first wires that connect the ground terminal to the substrate, and a second component mounted on the substrate, in which overlapping first wires in plan view.

公开(公告)号：US20230230907A1

公开(公告)日：2023-07-20

申请号：US18188538

申请日：2023-03-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tsuyoshi TAKAKURA ,  Ryoichi KITA ,  Hideo NAKAGOSHI ,  Hiroki YOSHIMORI ,  Tadashi NOMURA ,  Yoshihito OTSUBO

IPC: H01L23/498 ,  H01L25/18 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56 ,  H01L25/00

CPC classification number: H01L23/49811 ,  H01L25/18 ,  H01L23/5383 ,  H01L23/3157 ,  H01L23/3128 ,  H01L21/56 ,  H01L25/50

Abstract: A substrate structure comprises a substrate having a first surface, a first electrode disposed on the first surface, a bump connected to the first electrode, and a protective member that covers the first surface and covers a portion of the bump. The protective member has an opening. The bump includes a portion exposed through the opening. The bump includes a first portion that is connected to the first electrode, and a second portion that is located farther from the first electrode than the first portion and is connected to the first portion. The bump has a constriction at a boundary between the first portion and the second portion. When viewed in a direction perpendicular to the first surface, a maximum diameter of the second portion is smaller than a maximum diameter of the first portion.