FLEXIBLE BOARD, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE

    公开(公告)号:US20210100094A1

    公开(公告)日:2021-04-01

    申请号:US17120517

    申请日:2020-12-14

    Inventor: Fumiya ISONO

    Abstract: A flexible board includes a flexible resin base material, a conductor pattern on a principal surface of the resin base material and including first and second electrodes electrically separated from each other, a first protective film having lower flexibility than the resin base material and covering a portion of the conductor pattern, and a second protective film having higher flexibility than the first protective film and extending over the principal surface of the resin base material and the first protective film to cover another portion of the conductor pattern. The first protective film is closer to the first and second electrodes on the principal surface of the resin base material than the second protective film. The first protective film includes a first opening exposing a portion of the first electrode and a second opening exposing a portion of the second electrode in planar view.

    MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE
    3.
    发明公开

    公开(公告)号:US20240014536A1

    公开(公告)日:2024-01-11

    申请号:US18371591

    申请日:2023-09-22

    Abstract: In a first region, a multilayer body is bent along a first bending line such that a first main surface is located farther on an outer peripheral side than a second main surface. In a second region, the multilayer body is bent along a second bending line such that the first main surface is located farther on an inner peripheral side than the second main surface. In the first region, a first metal foil layer is located farther on an outer peripheral side than a center of the multilayer body. In the second region, a second metal foil layer is located farther on the outer peripheral side than the center of the multilayer body. In the second region, a distance between the second metal foil layer and the second main surface is shorter than a distance between the second metal foil layer and the first main surface.

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