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公开(公告)号:US20240030896A1
公开(公告)日:2024-01-25
申请号:US18478605
申请日:2023-09-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Sean MCHUGH , Gregory L. HEY-SHIPTON , Garrett WILLIAMS
CPC classification number: H03H9/6483 , H03H9/605 , H03H9/02559 , H03H9/725
Abstract: Filter devices. A first chip includes a first base, a first piezoelectric membrane having a first thickness, and a first acoustic Bragg reflector sandwiched between the first piezoelectric membrane and the first base. A first interdigital transducer (IDT) of a first solidly-mounted membrane resonator is formed on a surface of the first piezoelectric membrane. A second chip includes a second base, a second piezoelectric membrane having a second thickness less than the first thickness, and a second acoustic Bragg reflector sandwiched between the second piezoelectric membrane and the second base. A second IDT of a second solidly-mounted membrane resonator is formed on a surface of the second piezoelectric membrane. A circuit card is coupled to the first chip and the second chip, the circuit card including at least one conductor for making an electrical connection between the first IDT and the second IDT.
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公开(公告)号:US20250112617A1
公开(公告)日:2025-04-03
申请号:US18897043
申请日:2024-09-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Drew MOROSIN , John P. KOULAKIS , Garrett WILLIAMS
Abstract: An acoustic resonator is provided that includes an interdigital transducer (IDT) at a surface of at least one piezoelectric layer, the IDT including interleaved IDT fingers extending from first and second busbars respectively. Moreover, a ratio of a thickness of the IDT fingers to a thickness of the at least one piezoelectric layer is optimized to minimize unwanted spurs. The mark to pitch ratio of the IDT fingers may also be optimized to minimize spurs during operation.
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公开(公告)号:US20240429895A1
公开(公告)日:2024-12-26
申请号:US18824232
申请日:2024-09-04
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Sean MCHUGH , Gregory L. HEY-SHIPTON , Garrett WILLIAMS
Abstract: A filter device is proved that includes a first chip having a first interdigital transducer (IDT) of a first bulk acoustic resonator at a first piezoelectric plate, the first IDT disposed on a portion of the first piezoelectric plate over a first cavity of the first bulk acoustic resonator, and a second chip having a second IDT of a second bulk acoustic resonator formed at a second piezoelectric plate, the second IDT disposed on a portion of the second piezoelectric plate over a second cavity of the second bulk acoustic resonator. The filter device includes a circuit card coupled to the first chip and the second chip. A thickness of the first piezoelectric plate is greater than a thickness of the second piezoelectric plate.
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