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公开(公告)号：US20200344881A1
公开(公告)日：2020-10-29
申请号：US16926954
申请日：2020-07-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Daisuke TONARU , Genro KATO , Shinichi ARAKI
Abstract: In a board joint structure, a first board (board) and a component (mounting board) are joined together by a conductive joint material and an insulating joint material. The first board includes a first insulating substrate including a first main surface, a first electrode pad provided on the first main surface, a spacer, and the like. At least a portion of the insulating joint material and the spacer are located between the first board and the component, and the first electrode pad is joined to a second electrode pad of the component with the conductive joint material. A region of the first main surface other than a region where the first electrode pad is provided is joined to the component with the insulating joint material.
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公开(公告)号：US20220077555A1
公开(公告)日：2022-03-10
申请号：US17514215
申请日：2021-10-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kosuke OOI , Shingo ITO , Hiromasa KOYAMA , Genro KATO , Kotaro MISHIMA
Abstract: A transmission line substrate includes a line portion, a base including a first main surface and a second main surface opposite to the first main surface, first and second ground conductors, and a signal line. The first ground conductor is on the first main surface side. The second ground conductor is on the second main surface side. The first ground conductor includes first conductor-non-formed portions overlapping the signal line when viewed in the Z axis direction. The second ground conductor includes second conductor-non-formed portions overlapping the signal line when viewed in the Z axis direction. A total area of the second conductor-non-formed portions is less than a total area of the first conductor-non-formed portions.
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Patent Agency Ranking
公开(公告)号：US20210151845A1
公开(公告)日：2021-05-20
申请号：US17158072
申请日：2021-01-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takahiro BABA , Akihiro KIKUCHI , Genro KATO , Kosuke NISHINO , Nobuo IKEMOTO
Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.
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公开(公告)号：US20200323085A1
公开(公告)日：2020-10-08
申请号：US16910226
申请日：2020-06-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki YOSUI , Daisuke TONARU , Hideyuki TAGUCHI , Genro KATO
Abstract: A first board includes a first insulating substrate including a first main surface, a first electrode pad, and a first resist film. The first electrode pad is a conductor pattern provided on the first main surface. The first resist film is provided on the first main surface and is located closer to the first electrode pad than any conductor provided on the first main surface. The first resist film is spaced away from the first electrode pad with a gap provided between the first resist film and the first electrode pad. The first resist film is thicker than the first electrode pad.
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公开(公告)号：US20200227806A1
公开(公告)日：2020-07-16
申请号：US16833711
申请日：2020-03-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takahiro BABA , Akihiro KIKUCHI , Genro KATO , Kosuke NISHINO , Nobuo IKEMOTO
Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.
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公开(公告)号：US20190341665A1
公开(公告)日：2019-11-07
申请号：US16513814
申请日：2019-07-17
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takahiro BABA , Akihiro KIKUCHI , Genro KATO , Kosuke NISHINO , Nobuo IKEMOTO
Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.
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公开(公告)号：US20170125870A1
公开(公告)日：2017-05-04
申请号：US15407328
申请日：2017-01-17
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takahiro BABA , Akihiro KIKUCHI , Genro KATO , Kosuke NISHINO , Nobuo IKEMOTO
Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.
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