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公开(公告)号:US20200091104A1
公开(公告)日:2020-03-19
申请号:US16694053
申请日:2019-11-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Ryosuke TAKADA , Toshitaka HAYASHI , Hiromasa KOYAMA
Abstract: A multilayer wiring board includes a first insulating layer, a second insulating layer stacked on the first insulating layer, a via conductor inside each of the first insulating layer and the second insulating layer, and a conductive bonding layer that bonds the via conductors to each other. The first insulating layer is directly bonded to the second insulating layer, and a relationship a1>b1 is satisfied, where a1 is a maximum diameter of the bonding layer and b1 is a maximum diameter of the via conductor at an interface with the bonding layer.
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公开(公告)号:US20220077555A1
公开(公告)日:2022-03-10
申请号:US17514215
申请日:2021-10-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Kosuke OOI , Shingo ITO , Hiromasa KOYAMA , Genro KATO , Kotaro MISHIMA
Abstract: A transmission line substrate includes a line portion, a base including a first main surface and a second main surface opposite to the first main surface, first and second ground conductors, and a signal line. The first ground conductor is on the first main surface side. The second ground conductor is on the second main surface side. The first ground conductor includes first conductor-non-formed portions overlapping the signal line when viewed in the Z axis direction. The second ground conductor includes second conductor-non-formed portions overlapping the signal line when viewed in the Z axis direction. A total area of the second conductor-non-formed portions is less than a total area of the first conductor-non-formed portions.
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公开(公告)号:US20220077556A1
公开(公告)日:2022-03-10
申请号:US17530504
申请日:2021-11-19
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Yushi SOETA , Hiromasa KOYAMA
Abstract: A transmission line includes first, second, third, and fourth signal lines, and first, second, third, and fourth electrode pads respectively connected thereto. A first main surface of an external connection portion includes a first region in which the first electrode pad and the second electrode pad are provided, and a second region in which the third electrode pad and the fourth electrode pad are provided. Each of the first electrode pad and the second electrode pad, in a plan view, is surrounded by a ground electrode, and at least one of the third electrode pad and the fourth electrode pad, in the plan view, includes a portion that is not surrounded by the ground electrode.
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公开(公告)号:US20210345487A1
公开(公告)日:2021-11-04
申请号:US17368912
申请日:2021-07-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Hiromasa KOYAMA , Ryosuke TAKADA , Atsushi KASUYA
Abstract: A multilayer substrate includes a base body including a first main surface, a first external electrode provided on the first main surface and made of metal foil, a first interlayer connection conductor, and a second interlayer connection conductor having higher conductivity than the first interlayer connection conductor. The base body includes insulating base material layers that are stacked on one another. The first interlayer connection conductor is provided at least in an insulating base material layer on which the first external electrode is provided, and is connected to the first external electrode. The second interlayer connection conductor is disposed inside the base body, and is connected to the first external electrode through the first interlayer connection conductor.
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公开(公告)号:US20200245460A1
公开(公告)日:2020-07-30
申请号:US16850174
申请日:2020-04-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Hiromasa KOYAMA , Ryosuke TAKADA , Atsushi KASUYA
Abstract: A multilayer substrate includes a base body including a first main surface, a first external electrode provided on the first main surface and made of metal foil, a first interlayer connection conductor, and a second interlayer connection conductor having higher conductivity than the first interlayer connection conductor. The base body includes insulating base material layers that are stacked on one another. The first interlayer connection conductor is provided at least in an insulating base material layer on which the first external electrode is provided, and is connected to the first external electrode. The second interlayer connection conductor is disposed inside the base body, and is connected to the first external electrode through the first interlayer connection conductor.
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公开(公告)号:US20190088388A1
公开(公告)日:2019-03-21
申请号:US16181717
申请日:2018-11-06
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Takahiro BABA , Lijun ZHAO , Chu XU , Hiromasa KOYAMA , Satoshi MATSUURA
Abstract: A transmission line substrate includes a stacked body that includes insulating base materials, first and second signal lines, and first and second ground conductors. The second signal line is provided on a layer different from the layer of the first signal line and extends in parallel with the first signal line. The first ground conductor is provided on the same layer as the layer of the second signal line and overlapped with the first signal line when viewed in the Z-axis direction. The second ground conductor is provided on the same layer as the layer of the first signal line and overlapped with the second signal line when viewed in the Z-axis direction. A first transmission line includes the first signal line, the first ground conductor, and an insulating base material, and a second transmission line includes the second signal line, the second ground conductor, and the insulating base material.
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公开(公告)号:US20210249157A1
公开(公告)日:2021-08-12
申请号:US17245093
申请日:2021-04-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Takahiro BABA , Lijun ZHAO , Chu XU , Hiromasa KOYAMA , Satoshi MATSUURA
Abstract: A transmission line substrate includes a stacked body that includes insulating base materials, first and second signal lines, and first and second ground conductors. The second signal line is provided on a layer different from the layer of the first signal line and extends in parallel with the first signal line. The first ground conductor is provided on the same layer as the layer of the second signal line and overlapped with the first signal line when viewed in the Z-axis direction. The second ground conductor is provided on the same layer as the layer of the first signal line and overlapped with the second signal line when viewed in the Z-axis direction. A first transmission line includes the first signal line, the first ground conductor, and an insulating base material, and a second transmission line includes the second signal line, the second ground conductor, and the insulating base material.
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公开(公告)号:US20200267832A1
公开(公告)日:2020-08-20
申请号:US16865559
申请日:2020-05-04
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Hiromasa KOYAMA
IPC: H05K1/02
Abstract: A resin multilayer substrate includes a plurality of insulating resin base material layers and a plurality of conductor patterns provided on the plurality of insulating resin base material layers. The plurality of conductor patterns include a plurality of signal lines provided at positions not overlapping each other as viewed from a laminating direction of the insulating resin base material layers, and a ground conductor overlapping the plurality of the signal lines as viewed from the laminating direction. Openings are provided in the ground conductor and, as viewed from the laminating direction, an aperture ratio is higher in an inner zone that is sandwiched between two signal lines than in an outer zone of the two signal lines.
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公开(公告)号:US20200267831A1
公开(公告)日:2020-08-20
申请号:US16865457
申请日:2020-05-04
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Hiromasa KOYAMA
IPC: H05K1/02
Abstract: A resin multilayer substrate includes a plurality of insulating resin base material layers and a plurality of conductor patterns provided on the plurality of insulating resin base material layers. The plurality of conductor patterns include a signal line and a ground conductor overlapping the signal line as viewed from a laminating direction of the insulating resin base material layers. A plurality of openings are provided in the ground conductor, and an aperture ratio is higher in a zone far from the signal line than in a zone adjacent to or in a vicinity of the signal line in a direction perpendicular or substantially perpendicular to the laminating direction.
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公开(公告)号:US20200258828A1
公开(公告)日:2020-08-13
申请号:US16861731
申请日:2020-04-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Kanto IIDA , Hiromasa KOYAMA
IPC: H01L23/498
Abstract: An interposer includes a stacked body including insulating base material layers that are stacked on one another, first and second electrodes, a conductor pattern, and an interlayer connection conductor. The stacked body includes a first mounting surface including a first electrode, and a second mounting surface facing the first mounting surface and including a second electrode. The first electrode is electrically connected to the second electrode through the conductor pattern and the interlayer connection conductor. A length of an electrical path including conductor patterns connecting the first electrode and the second electrode is larger than a total length of the interlayer connection conductor in a stacking direction.
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