公开(公告)号：US20240047793A1

公开(公告)日：2024-02-08

申请号：US18487403

申请日：2023-10-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Haruhiko IKEDA ,  Toshitaka HAYASHI ,  Kouji ISHIKAWA ,  Tomohiro KATO ,  Toshiya KAWATE ,  Norikazu KUME ,  Akihiro MORI

IPC: H01M50/126 ,  H01M50/11 ,  H01M50/119 ,  H01M50/121

CPC classification number: H01M50/126 ,  H01M50/11 ,  H01M50/119 ,  H01M50/121

Abstract: A solid-state battery package that includes: a substrate; a solid-state battery on the substrate; and a water vapor barrier layer between the substrate and the solid-state battery. The water vapor barrier layer preferably has both an Si—O bond and an Si—N bond, and preferably has a water vapor transmission rate of less than 5×10−3 g/(m2·Day).

公开(公告)号：US20240047792A1

公开(公告)日：2024-02-08

申请号：US18487269

申请日：2023-10-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kouji ISHIKAWA ,  Haruhiko IKEDA ,  Toshitaka HAYASHI ,  Toshiya KAWATE ,  Yoshiyuki TONAMI

IPC: H01M50/126 ,  H01M50/11 ,  H01M50/121

CPC classification number: H01M50/126 ,  H01M50/11 ,  H01M50/121

Abstract: A solid-state battery package that includes: a substrate; and a solid-state battery on the substrate. The solid-state battery has: a battery element having a positive electrode layer, a negative electrode layer, and a solid electrolyte; and an end-face electrode on an end face of the battery element and connected to one of the positive or negative electrode layers. The substrate has a substrate electrode layer on a main surface thereof, and at least a first side surface of the substrate electrode layer and a first end face of the end-face electrode are substantially on an identical line in a sectional view, a distance between the first side surface and a second side surface of the substrate electrode layer is equal to or more than a minimum distance between the first end face and an end surface of the positive or negative electrode layer that the end-face electrode is not connected.

公开(公告)号：US20200091104A1

公开(公告)日：2020-03-19

申请号：US16694053

申请日：2019-11-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryosuke TAKADA ,  Toshitaka HAYASHI ,  Hiromasa KOYAMA

IPC: H01L23/00 ,  H05K1/11 ,  H05K1/02

Abstract: A multilayer wiring board includes a first insulating layer, a second insulating layer stacked on the first insulating layer, a via conductor inside each of the first insulating layer and the second insulating layer, and a conductive bonding layer that bonds the via conductors to each other. The first insulating layer is directly bonded to the second insulating layer, and a relationship a1>b1 is satisfied, where a1 is a maximum diameter of the bonding layer and b1 is a maximum diameter of the via conductor at an interface with the bonding layer.

公开(公告)号：US20160338201A1

公开(公告)日：2016-11-17

申请号：US15225379

申请日：2016-08-01

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Shinya KIYONO ,  Toshitaka HAYASHI ,  Sho FUJITA

IPC: H05K1/18 ,  H05K1/09 ,  H01L23/00 ,  H05K3/32

CPC classification number: H05K1/181 ,  B22F1/0059 ,  B22F7/064 ,  B23K35/025 ,  B23K35/302 ,  H01B1/22 ,  H01L23/3121 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13194 ,  H01L2224/13347 ,  H01L2224/13487 ,  H01L2224/16227 ,  H01L2224/16501 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29347 ,  H01L2224/2939 ,  H01L2224/29487 ,  H01L2224/81075 ,  H01L2224/81193 ,  H01L2224/81359 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8184 ,  H01L2224/83075 ,  H01L2224/8384 ,  H01L2924/12044 ,  H05K1/097 ,  H05K3/32 ,  H05K2201/0257 ,  H05K2201/10015 ,  H05K2203/1131 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0541 ,  H01L2924/01029 ,  H01L2924/01046

Abstract: An electronic component module formed with the use of a copper particle paste which can ensure that even the inner part of a joint material is sintered, where copper particles are excellent in oxidation resistance, and a joint part is provided with high joint reliability; and a method for manufacturing the module.

Abstract translation: 一种电子部件模块，其特征在于，使用能够确保铜粒子的耐氧化性优异的连接材料的内部甚至烧结的铜粒子糊，并且接合部具有高的接头可靠性; 以及该模块的制造方法。