公开(公告)号：US20190267303A1

公开(公告)日：2019-08-29

申请号：US16412822

申请日：2019-05-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroshi SOMADA

IPC: H01L23/31 ,  H01L23/12 ,  H01L23/522 ,  H01L23/29

Abstract: An electronic component includes a resin structure including first and second surfaces facing each other, an electronic component element contained in the resin structure, including first and second main surfaces facing each other, and side surfaces connecting the first and second main surfaces, and being exposed to the first surface of the resin structure, and a through-electrode penetrating the resin structure to connect the first and second surfaces of the resin structure, in which the through-electrode are in contact with at least one of the side surfaces of the electronic component element.

公开(公告)号：US20240364307A1

公开(公告)日：2024-10-31

申请号：US18766887

申请日：2024-07-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takashi IWAMOTO ,  Motoji TSUDA ,  Hiroshi SOMADA ,  Eiji FUJIMORI ,  Masaki KASAI ,  Takuma KUROYANAGI ,  Shinichiro TAKAYANAGI

IPC: H03H9/54 ,  H03H9/13 ,  H03H9/17

CPC classification number: H03H9/54 ,  H03H9/133 ,  H03H9/176

Abstract: A duplexer includes a piezoelectric substrate including an upper surface and a lower surface, a functional element on the lower surface, a flat plate electrode on a side of the upper surface of the piezoelectric substrate, and a dielectric portion that is located between the functional element and the flat plate electrode and has a permittivity lower than a permittivity of the piezoelectric substrate.

公开(公告)号：US20190109091A1

公开(公告)日：2019-04-11

申请号：US16212750

申请日：2018-12-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroshi SOMADA

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/29 ,  H01L23/66 ,  H01L23/60 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L25/10 ,  H01L25/00

Abstract: A method of manufacturing a component-embedded substrate includes a resist forming step in which a patterning resist is formed on a support, a patterning step in which a through hole extending through the resist is formed by performing patterning on the resist, a first-electrode forming step in which a through-via electrode is formed by filling the through hole with an electrode material, a resist removing step in which the resist is removed, a component placement step in which an electronic component is placed, a substrate forming step in which a resin substrate is formed by sealing the electronic component with a resin that includes a filler having a diameter larger than the surface roughness of a side surface of the through-via electrode, and a removing step in which the support is removed from the resin substrate. The first-electrode forming step is performed before the substrate forming step is performed.