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公开(公告)号:US11316486B2
公开(公告)日:2022-04-26
申请号:US16858013
申请日:2020-04-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Kazuaki Deguchi
Abstract: A high frequency circuit includes a transmit terminal and a transmit and receive terminal, a power amplifier that amplifies a high frequency signal inputted from the transmit terminal and outputs the high frequency signal toward the transmit and receive terminal, and an output matching circuit that is positioned on a signal path connecting the power amplifier and the transmit and receive terminal and that optimizes the output load impedance of the power amplifier. The output matching circuit includes a matching circuit coupled to an output terminal of the power amplifier, another matching circuit, and a switch that changes a connection between the matching circuits. The power amplifier and the switch are formed at a single semiconductor IC. The matching circuits are formed outside the semiconductor IC.
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公开(公告)号:US11962274B2
公开(公告)日:2024-04-16
申请号:US17401539
申请日:2021-08-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Tsutomu Oonaro , Masamichi Tokuda , Makoto Tabei , Kazuaki Deguchi , Takayuki Kawano
CPC classification number: H03F1/301 , H03F1/0211 , H03F3/21 , H03F2200/447 , H03F2200/451
Abstract: An amplifier device includes an amplifier including cascade-connected power amplifiers in a plurality of stages and a bias circuit configured to supply bias currents to the amplifier. A bias current supplied to a power amplifier in the first stage of the power amplifiers in the plurality of stages exhibits a positive temperature characteristic. A bias current supplied to a power amplifier in the final stage exhibits a negative temperature characteristic.
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