公开(公告)号：US20190318973A1

公开(公告)日：2019-10-17

申请号：US16454302

申请日：2019-06-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ken OKADA ,  Kazushige SATO ,  Shingo FUNAKAWA ,  Katsuhiko FUJIKAWA ,  Nobumitsu AMACHI

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/495 ,  H01L23/538 ,  H01L25/10 ,  H01L23/36 ,  H03H9/25 ,  H05K1/02

Abstract: A circuit module (101) includes a substrate (1) having a principal surface (1a), a first component (6) mounted on the principal surface (1a), and a sealing resin portion (3) that covers at least a side surface of the first component (6) while covering the principal surface (1a). The first component (6) includes an empty portion (6c) and a connection portion (6b) exposed to the empty portion (6c). The sealing resin portion (3) is arranged to avoid at least a part of a region that is included in an upper surface of the first component (6) and corresponds to the empty portion (6c).