公开(公告)号：US20190318974A1

公开(公告)日：2019-10-17

申请号：US16451825

申请日：2019-06-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Katsuhiko FUJIKAWA ,  Shingo FUNAKAWA ,  Kazushige SATO ,  Nobumitsu AMACHI

IPC: H01L23/31 ,  H01L23/29 ,  H01L23/36 ,  H01L23/495 ,  H01L25/065 ,  H05K3/36

Abstract: A circuit module (301) includes a first substrate (201), a first module (101), a sealing resin portion (3), and a conductive material film (7). The first substrate (201) has a first principal surface (201a). The first module (101) is mounted on the first principal surface (201a). The sealing resin portion (3) is formed on the first principal surface (201a) and covers the first module (101). The conductive material film (7) covers a side of the sealing resin portion (3). The first module (101) includes a conductive material portion and a device which may produce heat and which is mounted on the conductive material portion. The conductive material portion connects with the conductive material film (7) on the side of the sealing resin portion (3).

公开(公告)号：US20190318973A1

公开(公告)日：2019-10-17

申请号：US16454302

申请日：2019-06-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ken OKADA ,  Kazushige SATO ,  Shingo FUNAKAWA ,  Katsuhiko FUJIKAWA ,  Nobumitsu AMACHI

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/495 ,  H01L23/538 ,  H01L25/10 ,  H01L23/36 ,  H03H9/25 ,  H05K1/02

Abstract: A circuit module (101) includes a substrate (1) having a principal surface (1a), a first component (6) mounted on the principal surface (1a), and a sealing resin portion (3) that covers at least a side surface of the first component (6) while covering the principal surface (1a). The first component (6) includes an empty portion (6c) and a connection portion (6b) exposed to the empty portion (6c). The sealing resin portion (3) is arranged to avoid at least a part of a region that is included in an upper surface of the first component (6) and corresponds to the empty portion (6c).

公开(公告)号：US20190181068A1

公开(公告)日：2019-06-13

申请号：US16278381

申请日：2019-02-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shingo FUNAKAWA ,  Nobumitsu AMACHI

IPC: H01L23/31 ,  H01L23/538 ,  H01L21/56 ,  H01L23/00

Abstract: A circuit module includes a flat substrate, a frame substrate, a first electronic component, and a first sealing member. First connection electrodes are disposed at a peripheral portion of one main surface of the flat substrate. Second connection electrodes are disposed on one main surface of the frame substrate at locations corresponding to the first connection electrodes. Each of the first connection electrodes and a corresponding one of the second connection electrodes are connected to each other via a first connection member. The first electronic component is sealed by the first sealing member. The first electronic component and the first sealing member are disposed in a cavity defined by the one main surface of the flat substrate and an inner surface of the frame substrate. The first sealing member is separated from the inner surface of the frame substrate.