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公开(公告)号：US20210166857A1
公开(公告)日：2021-06-03
申请号：US17175303
申请日：2021-02-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Scott Andrew PARISH , Lee FRANCIS
Abstract: A transformer includes an isolation core casing of a power converter. The transformer includes a primary winding, a secondary winding, a magnetic core, a cover, and a cup. The cover and cup are joined and sealed together to form the core casing. The primary winding is wound directly on the magnetic core, and the magnetic core is sealed within the core casing. The secondary winding is wound around the core casing such that the primary and secondary windings are electrically isolated from each other by a solid insulation barrier provided by the core casing, resulting in no increase in the creepage or the clearance path between the primary and the secondary windings, which allows the transformer to be miniaturized without negatively affecting safety and converter performance due to leakage inductance.
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公开(公告)号：US20240055178A1
公开(公告)日：2024-02-15
申请号：US18232682
申请日：2023-08-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takayuki TANGE , Lee FRANCIS , Scott Andrew PARISH , Rohit SIDAPARA
CPC classification number: H01F27/324 , H05K1/181 , H01F27/2895 , H01F27/292 , H01F27/306 , H05K2201/1003 , H05K2201/10015 , H01F27/2804 , H01F2027/2809 , H05K1/165
Abstract: An electronic module includes a substrate or a lead frame including primary conductive patterns and secondary conductive patterns; a magnetic core; a block coil including a resin body that is located on or above the substrate or the lead frame and that extends over the magnetic core, first terminals that define a first terminal group and that are on or embedded in the resin body, and second terminals that define a second terminal group and that on or are embedded in the resin body; an IC; and a capacitor. Two first terminals of the first terminal group are connected to corresponding primary conductive patterns; two second terminals of the second terminal group are connected corresponding secondary conductive patterns; and a first primary conductive pattern is closer to a second primary conductive pattern than any of the secondary conductive patterns.
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公开(公告)号：US20180019055A1
公开(公告)日：2018-01-18
申请号：US15717998
申请日：2017-09-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Scott Andrew PARISH , Lee FRANCIS
Abstract: An embedded magnetic component device includes a magnetic core located in a cavity extending into an insulating substrate. The cavity and magnetic core are coved with a cover layer. Through holes extend through the cover layer and the insulating substrate, and are plated to define conductive vias. Metallic traces are provided at exterior surfaces of the cover layer and the insulating substrate to define upper and lower winding layers. The metallic traces and conductive vias define the respective primary and secondary side windings for an embedded transformer. At least a first isolation barrier is provided on the cover layer, and at least a third insulating layer is provided on the substrate. The second and third insulating layers provide additional insulation for the device, and define and function as a circuit board for surface mounted power electronics.
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公开(公告)号：US20160254089A1
公开(公告)日：2016-09-01
申请号：US15054412
申请日：2016-02-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Scott Andrew PARISH , Christopher FEATHERSTONE
Abstract: In a method of manufacturing a plurality of embedded magnetic component devices, a row of cavities for respective magnetic cores is formed in an insulating substrate. Neighboring cavities are connected to each other by channels formed in the substrate. Adhesive is applied to a cavity floor throughout the row of cavities, and magnetic cores are inserted into the cavities. The cavities and magnetic cores are covered with a first insulating layer. Through holes are formed through the first insulating layer and the insulating substrate, and plated up to form conductive vias. Metallic traces are added to the exterior surfaces of the first insulating layer and the insulating substrate to form upper and lower winding layers. The metallic traces and conductive vias form the windings for an embedded magnetic component, such as transformer or inductor.
Abstract translation: 在制造多个嵌入式磁性部件装置的方法中，在绝缘基板上形成用于各个磁芯的一排空腔。 相邻的腔通过形成在衬底中的通道相互连接。 将粘合剂施加到整个空腔行的空腔地板，并将磁芯插入空腔中。 空腔和磁芯被第一绝缘层覆盖。 通过第一绝缘层和绝缘基板形成通孔，并且电镀形成导电通路。 金属迹线被添加到第一绝缘层和绝缘基板的外表面上以形成上和下绕组层。 金属迹线和导电通孔形成用于嵌入式磁性部件（例如变压器或电感器）的绕组。
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公开(公告)号：US20240258014A1
公开(公告)日：2024-08-01
申请号：US18565410
申请日：2022-06-15
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takayuki TANGE , Scott Andrew PARISH
CPC classification number: H01F27/2804 , H01F27/2852 , H01F41/041 , H01F2027/2809 , H01F2027/2819
Abstract: A device includes a substrate; a magnetic core in the substrate, including a hole, and divided into a first half and a second half opposite to the first half; a first winding extending through the hole and around the magnetic core; a second winding extending through the hole and around the magnetic core; and a third winding extending through the hole, around the magnetic core, and around a portion of the first winding. The first and the third windings only extend around the same half of the magnetic core. At least one first turn of the second winding extends around the second half of the magnetic core.
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Patent Agency Ranking
公开(公告)号：US20230420175A1
公开(公告)日：2023-12-28
申请号：US18242702
申请日：2023-09-06
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Scott Andrew PARISH , Lee FRANCIS
CPC classification number: H01F27/2804 , H01F27/2895 , H01F41/046 , H01F41/06 , H01F41/12 , H01F41/122 , H01F41/041 , H01F2027/2809 , H01F41/125
Abstract: An embedded magnetic component device includes a magnetic core located in a cavity extending into an insulating substrate. The cavity and magnetic core are coved with a cover layer. Through holes extend through the cover layer and the insulating substrate, and are plated to define conductive vias. Metallic traces are provided at exterior surfaces of the cover layer and the insulating substrate to define upper and lower winding layers. The metallic traces and conductive vias define the respective primary and secondary side windings for an embedded transformer. At least a first isolation barrier is provided on the cover layer, and at least a third insulating layer is provided on the substrate. The second and third insulating layers provide additional insulation for the device, and define and function as a circuit board for surface mounted power electronics.
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公开(公告)号：US20200251274A1
公开(公告)日：2020-08-06
申请号：US16852588
申请日：2020-04-20
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Scott Andrew PARISH , Lee FRANCIS
Abstract: An embedded magnetic component device includes a magnetic core located in a cavity extending into an insulating substrate. The cavity and magnetic core are covered with a cover layer. Through holes extend through the cover layer and the insulating substrate, and are plated to define conductive vias. Metallic traces are provided at exterior surfaces of the cover layer and the insulating substrate to define upper and lower winding layers. The metallic traces and conductive vias define the respective primary and secondary side windings for an embedded transformer. At least a first isolation barrier is provided on the cover layer, and at least a third insulating layer is provided on the substrate. The second and third insulating layers provide additional insulation for the device, and define and function as a circuit board for surface mounted power electronics.
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公开(公告)号：US20190267180A1
公开(公告)日：2019-08-29
申请号：US15929130
申请日：2019-05-15
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Quinn Robert KNELLER , Scott Andrew PARISH , Justin MORGAN
Abstract: An embedded magnetic component device includes a magnetic core located in a cavity in an insulating substrate. An electrical winding includes inner and outer conductive connectors. An inner solid bonded joint boundary is located between first and second portions of the insulating substrate and extends between the cavity and the inner conductive connectors. An outer solid bonded joint boundary is located between the first and the second portions of the insulating substrate extends between the cavity and the outer conductive connectors. The minimum distance of the inner solid bonded joint boundary between any of the inner conductive connectors and the inner interior wall of the cavity is defined as D1, and the minimum distance of the outer solid bonded joint boundary between any of the outer conductive connectors and the outer interior wall of the cavity is defined as D2. D1 and D2 are about 0.4 mm or more.
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公开(公告)号：US20160049236A1
公开(公告)日：2016-02-18
申请号：US14825332
申请日：2015-08-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Quinn Robert KNELLER , Scott Andrew PARISH , Justin MORGAN
CPC classification number: H01F27/2804 , H01F27/2895 , H01F41/046 , H01F2027/2809
Abstract: An embedded magnetic component device includes a magnetic core located in a cavity in an insulating substrate. An electrical winding includes inner and outer conductive connectors. An inner solid bonded joint boundary is located between first and second portions of the insulating substrate and extends between the cavity and the inner conductive connectors. An outer solid bonded joint boundary is located between the first and the second portions of the insulating substrate extends between the cavity and the outer conductive connectors. The minimum distance of the inner solid bonded joint boundary between any of the inner conductive connectors and the inner interior wall of the cavity is defined as D1, and the minimum distance of the outer solid bonded joint boundary between any of the outer conductive connectors and the outer interior wall of the cavity is defined as D2. D1 and D2 are about 0.4 mm or more.
Abstract translation: 嵌入式磁性部件装置包括位于绝缘基板的空腔中的磁芯。 电绕组包括内导电连接器和外导电连接器。 内部固体接合接合边界位于绝缘基板的第一和第二部分之间并且在空腔和内部导电连接器之间延伸。 绝缘基底的第一部分和第二部分之间的外部固体接合边界位于空腔和外部导电连接器之间。 任何内部导电连接器和空腔的内部内壁之间的内部固体接合边界的最小距离定义为D1，并且任何外部导电连接器和外部导电连接器之间的外部固体接合接合边界的最小距离 空腔的外部内壁被定义为D2。 D1和D2约为0.4mm以上。
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公开(公告)号：US20250087409A1
公开(公告)日：2025-03-13
申请号：US18825361
申请日：2024-09-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Scott Andrew PARISH , Takayuki TANGE
Abstract: An electronic module includes a substrate or a lead frame including a primary conductive pattern and a secondary conductive pattern; a magnetic core located on or above the substrate or the lead frame; a block coil including a resin body that is located on or above the substrate or the lead frame and that extends over the magnetic core, a first terminal that is on or embedded in the resin body and that is connected to the primary conductive pattern, and a second terminal that is on or embedded in the resin body and that is connected to the secondary conductive pattern; and an electronic component located on the substrate or the lead frame.
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