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    PHOTOSENSITIVE INSULATING PASTE AND ELECTRONIC COMPONENT
    1.
    发明申请
    PHOTOSENSITIVE INSULATING PASTE AND ELECTRONIC COMPONENT 有权

    公开(公告)号：US20210096464A1

    公开(公告)日：2021-04-01

    申请号：US16995420

    申请日：2020-08-17

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kenta KONDO ,  Shimpei TANABE

    IPC: G03F7/004 ,  C03C8/20 ,  G03F7/028 ,  H05K1/03 ,  H05K3/46 ,  H05K3/00

    Abstract: A photosensitive insulating paste according to preferred embodiments of the present disclosure contains glass frit, a first inorganic filler, a second inorganic filler, an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, and a solvent. The first inorganic filler has a refractive index of 1.7 or higher. The second inorganic filler has a refractive index of 1.55 or lower. An electronic component according to preferred embodiments of the present disclosure is produced by using the photosensitive insulating paste.

    LAMINATED INDUCTOR COMPONENT
    2.
    发明公开
    LAMINATED INDUCTOR COMPONENT 审中-公开

    公开(公告)号：US20230253139A1

    公开(公告)日：2023-08-10

    申请号：US18296848

    申请日：2023-04-06

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Tomohiro KIDO ,  Shimpei TANABE ,  Yoshiyuki OOTA

    IPC: H01F17/00 ,  H01F17/02 ,  H01F41/12 ,  H01F27/32 ,  H01F41/04 ,  H01F27/29

    CPC classification number: H01F17/0013 ,  H01F17/02 ,  H01F41/122 ,  H01F27/323 ,  H01F41/043 ,  H01F27/29

    Abstract: A laminated inductor component includes a multilayer body which includes a first side surface, a second side surface and a bottom surface, and in which a plurality of insulator layers is laminated in a lamination direction; a coil conductor in helical form including a plurality of coil conductor layers wound on the insulator layers, and having a coil length parallel to the lamination direction; a first outer conductor electrically connected to a first end of the coil conductor and exposed from the first side surface and the bottom surface in the multilayer body; and a second outer conductor electrically connected to a second end of the coil conductor and exposed from the second side surface and the bottom surface in the multilayer body. A width along the lamination direction of each of the first outer conductor and the second outer conductor is shorter than the coil length.

    MULTILAYER COIL COMPONENT
    4.
    发明申请
    MULTILAYER COIL COMPONENT 审中-公开

    公开(公告)号：US20200075221A1

    公开(公告)日：2020-03-05

    申请号：US16547475

    申请日：2019-08-21

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Shimpei TANABE ,  Morihiro HAMANO

    IPC: H01F27/28 ,  H01F27/29

    Abstract: A multilayer coil component includes an element body that includes a plurality of insulating layers laminated together, a coil that is embedded in the element body and that includes a coil conductor layer provided between the insulating layers, and a first outer electrode and a second outer electrode each of which is provided on at least one of outer surfaces of the element body and each of which is electrically connected to the coil. A dissimilar-material layer that is made of a material different from the insulating layers is provided on at least one of the outer surfaces of the element body that extend in a lamination direction in which the plurality of insulating layers are laminated together.

    ELECTRONIC COMPONENT
    5.
    发明申请
    ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20190096569A1

    公开(公告)日：2019-03-28

    申请号：US16136060

    申请日：2018-09-19

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Shimpei TANABE

    IPC: H01F27/29 ,  H01F17/00 ,  H01G4/40 ,  H01F41/04 ,  H03H7/01

    Abstract: An electronic component is mounted on a circuit board such that a mounting surface of an element body to which a first outer electrode and a second outer electrode are exposed is directed toward the circuit board. A coil is formed of a spiral coil in which a plurality of coil conductor layers arranged in a direction perpendicular to a first side surface and a second side surface orthogonal to the mounting surface are connected in series. Then, an intermediate point between a lowest point closest to the mounting surface and an uppermost point farthest from the mounting surface in an inner circumference of the coil is offset from the center of the element body in a direction perpendicular to the mounting surface toward the opposite side to the mounting surface.

    ELECTRONIC COMPONENT
    7.
    发明申请
    ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20190311832A1

    公开(公告)日：2019-10-10

    申请号：US16373535

    申请日：2019-04-02

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Shimpei TANABE ,  Rikiya SANO ,  Hiromi MIYOSHI

    IPC: H01F17/00 ,  H01G4/005 ,  H01G4/30 ,  H01G4/232 ,  H01F41/04 ,  H05K1/16 ,  H05K3/46

    Abstract: An electronic component includes a body having a side surface, coil conductor layers wound along main surfaces parallel to the side surface, and capacitor conductor layers each having a substantially plate-like shape parallel to the side surface. The coil conductor layers and the capacitor conductor layers are arranged in a widthwise direction perpendicular to the side surface. The capacitor conductor layers include first and second capacitor conductor layers adjacent to each other in the widthwise direction. The coil conductor layers include a first coil conductor layer that is in the same layer as the first capacitor conductor layer and a second coil conductor layer that is in the same layer as the second capacitor conductor layer. The shortest distance between the first coil conductor layer and the first capacitor conductor layer is larger than the shortest distance between the second coil conductor layer and the second capacitor conductor layer.

    LAMINATED INDUCTOR COMPONENT
    9.
    发明申请
    LAMINATED INDUCTOR COMPONENT 审中-公开

    公开(公告)号：US20190189325A1

    公开(公告)日：2019-06-20

    申请号：US16205057

    申请日：2018-11-29

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Tomohiro KIDO ,  Shimpei TANABE ,  Yoshiyuki OOTA

    IPC: H01F17/00 ,  H01F17/02 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

    CPC classification number: H01F17/0013 ,  H01F17/02 ,  H01F27/29 ,  H01F27/323 ,  H01F41/043 ,  H01F41/122

    Abstract: A laminated inductor component includes a multilayer body which includes a first side surface, a second side surface and a bottom surface, and in which a plurality of insulator layers is laminated in a lamination direction; a coil conductor in helical form including a plurality of coil conductor layers wound on the insulator layers, and having a coil length parallel to the lamination direction; a first outer conductor electrically connected to a first end of the coil conductor and exposed from the first side surface and the bottom surface in the multilayer body; and a second outer conductor electrically connected to a second end of the coil conductor and exposed from the second side surface and the bottom surface in the multilayer body. A width along the lamination direction of each of the first outer conductor and the second outer conductor is shorter than the coil length.

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