公开(公告)号：US20140003017A1

公开(公告)日：2014-01-02

申请号：US14016415

申请日：2013-09-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Seiji KAI ,  Shintaro NAKATANI ,  Mitsuyoshi HIRA ,  Takao MUKAI ,  Hisashi YAMAZAKI

IPC: H05K1/18 ,  H03H3/08

CPC classification number: H05K1/182 ,  H03H3/08 ,  H03H9/1071 ,  H05K3/3431 ,  H05K2201/0999 ,  H05K2201/10083 ,  H05K2201/2018 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49165

Abstract: An electronic component includes a frame-shaped supporting body including a heat-curable resin and surrounding a functional unit on one main surface of a substrate and so as to be separated from a periphery of the substrate on an inner side and in which a lid member is fixed to the supporting body such that an opening of the frame-shaped supporting body is sealed. The frame-shaped supporting body includes a frame-shaped supporting body main body, a first protrusion that protrudes toward an inside from the supporting body main body and a second protrusion that protrudes toward an outside from the supporting body main body at a portion where the supporting body main body and the first protrusion are continuous with each other.

Abstract translation: 电子部件包括：框状支撑体，其包括热固性树脂，并且在基板的一个主表面上包围功能单元，并且在内侧与基板的周边分离，并且盖部件 被固定到支撑体上，使得框状支撑体的开口被密封。 框状支撑体包括框架状支撑体主体，从支撑体主体向内侧突出的第一突起和从支撑体主体向外侧突出的第二突起， 支撑体主体和第一突起彼此连续。