RESIN FILM WITH CONDUCTOR LAYER, MULTILAYER SUBSTRATE, AND METHOD FOR PRODUCING RESIN FILM WITH CONDUCTOR LAYER

    公开(公告)号:US20230262876A1

    公开(公告)日:2023-08-17

    申请号:US18193696

    申请日:2023-03-31

    CPC classification number: H05K1/024 H05K2201/0141 H05K2201/0129

    Abstract: A laminate structure that includes: a resin film containing a thermoplastic resin and having a plurality of voids; and a conductor layer adjacent to a main surface of the resin film, wherein a first set of voids of the plurality of voids are localized between a first position proximal to an end surface of the resin film facing the conductor layer and a second position distant from the first position by one-third of the thickness of the resin film in a lamination direction of the resin film and the conductor layer such that the first set of voids between the first position and the second position are greater in number than a second set of voids between the second position and a third position distant from the second position by one-third of the thickness of the resin film in a direction away from the first position in the lamination direction.

Patent Agency Ranking