公开(公告)号：US20240270567A1

公开(公告)日：2024-08-15

申请号：US18632485

申请日：2024-04-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroshi MATSUBARA ,  Shinsuke IKEUCHI ,  Ryosuke NIWA ,  Takahiro ASADA

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00309 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2203/0353 ,  B81B2203/04 ,  B81B2207/096 ,  B81C2203/035

Abstract: An acoustic device includes a substrate including a first surface and a second surface facing a side opposite to the first surface, an opening, an acoustic MEMS element fixed to the first surface to cover the opening, an annular electrode surrounding the opening on the second surface, and a solder resist layer covering the second surface adjacently to the annular electrode on an outer side and an inner side of the annular electrode The solder resist layer includes a first cutaway portion to connect a first portion and a second portion to each other, the first portion being any portion in an edge of the annular electrode the second portion being any portion in an edge of the substrate.