公开(公告)号：US20220007499A1

公开(公告)日：2022-01-06

申请号：US17480429

申请日：2021-09-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuya OKAMOTO ,  Takashi HAGA ,  Masayoshi TAKAGI ,  Kazushige SATO

IPC: H05K1/02 ,  H01R12/52 ,  H01R13/52

Abstract: A module according to the present disclosure includes a circuit board, an electronic component on one of two principal surfaces of the circuit board, a connection conductor on the principal surface of the circuit board, and sealing resin on the principal surface of the circuit board. The electronic component and the connection conductor are covered with the sealing resin. The connection conductor includes a plate-shaped conductor and terminal sections. The plate-shaped conductor is disposed upright on the principal surface of the circuit board. The terminal sections extend from the plate-shaped conductor and away from the principal surface of the circuit board and are arranged side by side. Tip portions of the terminal sections are exposed at a surface of the sealing resin.

公开(公告)号：US20250013794A1

公开(公告)日：2025-01-09

申请号：US18891291

申请日：2024-09-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tomoshige FURUHI ,  Takashi WATANABE ,  Takashi HAGA ,  Takehiko IIZUKA ,  Nobuyuki NOZAWA ,  Jun MAKINO

IPC: G06F30/10 ,  G06F17/16

Abstract: An arithmetic circuit according to the present disclosure performs a signal value acquisition step of acquiring X-axis bending values, Y-axis bending values, and twisting values at respective one or more first times before an impact time identified in a time identification step and at respective one or more second times after the impact time; and a first calculation step of calculating one or more parameters indicating a state of an object to be measured at the impact time by multiplying a plurality of the X-axis bending values, a plurality of the Y-axis bending values, and a plurality of the twisting values acquired in the signal value acquisition step by a matrix.