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    PROCESSING DEVICE
    2.
    发明公开
    PROCESSING DEVICE 审中-公开

    公开(公告)号：US20240091620A1

    公开(公告)日：2024-03-21

    申请号：US18522834

    申请日：2023-11-29

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Takehiko IIZUKA ,  Tomoshige FURUHI ,  Koji KAWANO ,  Jun MAKINO

    IPC: A63B69/36

    CPC classification number: A63B69/3617 ,  A63B69/3614

    Abstract: A processing device includes an operation circuit that determines based on a first signal a swing start time, the first signal being acquired from a sensor that is attached to a striking member for striking a to-be-struck object by being swung and that detects deformation of the striking member when the striking member is swung. An absolute value of a difference between a reference value and a value of the first signal is defined as a first difference value. The operation circuit executes a first determination step in which an impact time is determined based on one or more times at which the first difference value becomes greater than or equal to a first determination value.

    ARITHMETIC CIRCUIT AND ARITHMETIC PROGRAM
    4.
    发明申请
    ARITHMETIC CIRCUIT AND ARITHMETIC PROGRAM 有权

    公开(公告)号：US20250013794A1

    公开(公告)日：2025-01-09

    申请号：US18891291

    申请日：2024-09-20

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Tomoshige FURUHI ,  Takashi WATANABE ,  Takashi HAGA ,  Takehiko IIZUKA ,  Nobuyuki NOZAWA ,  Jun MAKINO

    IPC: G06F30/10 ,  G06F17/16

    Abstract: An arithmetic circuit according to the present disclosure performs a signal value acquisition step of acquiring X-axis bending values, Y-axis bending values, and twisting values at respective one or more first times before an impact time identified in a time identification step and at respective one or more second times after the impact time; and a first calculation step of calculating one or more parameters indicating a state of an object to be measured at the impact time by multiplying a plurality of the X-axis bending values, a plurality of the Y-axis bending values, and a plurality of the twisting values acquired in the signal value acquisition step by a matrix.

    DATA PROCESSING APPARATUS AND PROGRAM
    5.
    发明公开
    DATA PROCESSING APPARATUS AND PROGRAM 审中-公开

    公开(公告)号：US20240143284A1

    公开(公告)日：2024-05-02

    申请号：US18410167

    申请日：2024-01-11

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Jun MAKINO ,  Koji KAWANO ,  Nobuyuki NOZAWA ,  Tomoshige FURUHI ,  Takashi WATANABE ,  Takehiko IIZUKA ,  Kenta AGO

    IPC: G06F7/76

    CPC classification number: G06F7/76

    Abstract: A data processing apparatus includes an arithmetic circuit that performs an acquiring step of acquiring swing data indicating relationship between a physical quantity concerning an amount of deformation of an object to be measured and time, a determining step of determining whether the swing data indicates the physical quantity concerning the amount of deformation of the object to be measured, which occurs when the object to be measured is swung, to determine whether the swing data is to be deleted, and a deleting step of deleting the swing data if it is determined that the swing data does not indicate the physical quantity concerning the amount of deformation of the object to be measured, which occurs when the object to be measured is swung.

    SENSOR UNIT AND SENSOR UNIT ATTACHMENT METHOD
    7.
    发明公开
    SENSOR UNIT AND SENSOR UNIT ATTACHMENT METHOD 审中-公开

    公开(公告)号：US20240068796A1

    公开(公告)日：2024-02-29

    申请号：US18505560

    申请日：2023-11-09

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Takehiko IIZUKA ,  Nobuyuki NOZAWA ,  Tomoshige FURUHI ,  Koji KAWANO ,  Takashi WATANABE ,  Jun MAKINO ,  Kenta AGO

    IPC: G01B7/16

    CPC classification number: G01B7/16

    Abstract: Provided is a sensor unit including a first sensor portion that detects deformation of a measuring target object and a second sensor portion that detects deformation of the measuring target object, in which in a state in which the first sensor portion and the second sensor portion are attached to the measuring target object, the first sensor portion and the second sensor portion are fixed to the measuring target object such that the measuring target object is disposed between the first sensor portion and the second sensor portion in a first direction, and a physical property value of the first sensor portion and a physical property value of the second sensor portion are changed according to first deformation of the measuring target object.

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