公开(公告)号：US11348726B2

公开(公告)日：2022-05-31

申请号：US16527170

申请日：2019-07-31

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takehito Ishihara ,  Noriyuki Inoue ,  Tatsuya Funaki

IPC: H01G4/005 ,  H01G4/33 ,  H01G9/07 ,  H01L49/02

Abstract: A capacitor is provided that includes an electrostatic capacitance forming portion with a first electrode/dielectric layer/second electrode structure, and a silicon portion. Moreover, the silicon portion is disposed on at least a part of a side of the electrostatic capacitance forming portion. When the capacitor is viewed in a thickness direction thereof, a region occupied by the silicon portion in a lower portion of the electrostatic capacitance forming portion is 50% or less.

公开(公告)号：US11196405B2

公开(公告)日：2021-12-07

申请号：US15877746

申请日：2018-01-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kouji Ishikawa ,  Akio Katsube ,  Takehito Ishihara ,  Takeshi Ono

IPC: H03H9/10 ,  H03H3/02 ,  H03H9/05 ,  H03H9/17 ,  H03H9/15

Abstract: An electronic component that includes an electronic element; a base member having an upper surface on which the electronic element is mounted; and a lid member bonded to the base member via a bonding member such that the electronic element is hermetically sealed therebetween. The bonding member is made of an insulating material containing a first metal. The lid member has an outermost layer formed on at least a surface of the lid member facing the base member. The outermost layer of the lid member has a solid solution layer of the first metal and a second metal at at least a portion of the outermost layer.

公开(公告)号：US20190355516A1

公开(公告)日：2019-11-21

申请号：US16527170

申请日：2019-07-31

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takehito Ishihara ,  Noriyuki Inoue ,  Tatsuya Funaki

IPC: H01G4/12 ,  H01L21/822 ,  H01L27/04 ,  H01G4/005 ,  H01G4/33 ,  H01G9/00 ,  H01G9/07 ,  H01L49/02

Abstract: A capacitor is provided that includes an electrostatic capacitance forming portion with a first electrode/dielectric layer/second electrode structure, and a silicon portion. Moreover, the silicon portion is disposed on at least a part of a side of the electrostatic capacitance forming portion. When the capacitor is viewed in a thickness direction thereof, a region occupied by the silicon portion in a lower portion of the electrostatic capacitance forming portion is 50% or less.

公开(公告)号：US11646155B2

公开(公告)日：2023-05-09

申请号：US17344666

申请日：2021-06-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takehito Ishihara ,  Tatsuya Funaki ,  Haruhiko Ikeda

IPC: H01G4/005 ,  H01G4/224

CPC classification number: H01G4/005 ,  H01G4/224

Abstract: An electrode-equipped passive component is an electrode-equipped passive component to be mounted on a mount target, and includes a passive component main body, an electrode provided on a mount surface of the passive component main body, and an underfill layer provided on the mount surface of the passive component main body. The underfill layer includes a thermosetting resin, a flux, and a solvent, and has a surface having a skin layer. The skin layer has tack power equal to or smaller than 25 mN/mm2 at room temperature and equal to or larger than 60 mN/mm2 at 40° C.