ELECTRONIC COMPONENT
    1.
    发明公开

    公开(公告)号:US20240321487A1

    公开(公告)日:2024-09-26

    申请号:US18671036

    申请日:2024-05-22

    CPC classification number: H01C7/041 H01C1/1413

    Abstract: An electronic component that includes: a base body; a glass film covering at least a part of an outer surface of the base body; and an underlayer electrode covering a part of a surface of the glass film, wherein the base body contains a Mn oxide, the underlayer electrode contains a conductive metal and a glass component, the base body has a reaction layer containing a composite oxide of Mn and the conductive metal at an end portion of the underlayer electrode, and the reaction layer has a void.

    ELECTRONIC COMPONENT
    2.
    发明公开

    公开(公告)号:US20240021347A1

    公开(公告)日:2024-01-18

    申请号:US18475734

    申请日:2023-09-27

    CPC classification number: H01C7/04 H01C1/1413

    Abstract: An electronic component that includes: a base body; and an insulating film covering an outer surface of the base body. The insulating film includes the film main body and a plurality of the thick film portions. A material of the film main body includes a glass. A material of the thick film portion is the same as the glass of the film main body. A thickness of the thick film portion is larger than an average thickness of the film main body.

    ELECTRONIC COMPONENT
    3.
    发明公开

    公开(公告)号:US20240112835A1

    公开(公告)日:2024-04-04

    申请号:US18536992

    申请日:2023-12-12

    CPC classification number: H01C7/008 H01C1/1413 H01C7/041

    Abstract: An electronic component that includes: a base body having an outer surface defining a recess with an inner surface, wherein, when the recess is viewed in a direction orthogonal to the outer surface, at least a part of an outer edge of the recess is curved, and when the recess is viewed in a section orthogonal to the outer surface, at least a part of the inner surface of the recess is curved; a wiring inside the base body; and a glass film covering the outer surface of the base body and not covering the inner surface of the recess.

    ELECTRONIC COMPONENT
    5.
    发明公开

    公开(公告)号:US20240021346A1

    公开(公告)日:2024-01-18

    申请号:US18475294

    申请日:2023-09-27

    CPC classification number: H01C7/04 H01C1/1413

    Abstract: An electronic component that includes: an element body; and an insulating film covering an outer surface of the element body. The element body has a crack that opens to the outer surface. In a cross section orthogonal to the outer surface, the crack has a first portion that extends from the opening and intersects an axis orthogonal to the outer surface. In addition, one portion of the insulating film penetrates into at least an inner space of the first portion of the crack.

    ELECTRONIC COMPONENT
    6.
    发明公开

    公开(公告)号:US20240136093A1

    公开(公告)日:2024-04-25

    申请号:US18400627

    申请日:2023-12-29

    CPC classification number: H01C7/043 H01C1/1413

    Abstract: An electronic component that includes: a base body; wiring inside the base body; a glass film covering an outer surface of the base body; an underlying electrode electrically connected to the wiring and covering a part of the glass film; and a metal layer covering the underlying electrode, wherein the glass film includes an uncovered portion that is not covered with the underlying electrode and separated from an outer edge of the underlying electrode by more than 10 μm, and a boundary portion that is not covered with the underlying electrode and not separated from the outer edge of the underlying electrode by more than 10 μm, and a thickness of the boundary portion is larger than a thickness of the uncovered portion.

Patent Agency Ranking