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公开(公告)号：US20220255180A1
公开(公告)日：2022-08-11
申请号：US17730285
申请日：2022-04-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Nobuyuki TENNO , Yasushi OYAMA , Daisuke SAKAI , Byung No BAE
IPC: H01M50/284 , H01Q1/22 , H01M50/296
Abstract: An electronic device includes a flexible substrate, a circuit substrate, and a battery pack including a conductor portion. The battery pack includes a battery that supplies power to the circuit substrate and includes a main surface and a side surface. The flexible substrate includes a radiating conductor. The flexible substrate includes bent portions at a central portion in the direction in which a transmission line extends so that the flexible substrate faces the side surface. The radiating conductor overlaps the conductor portion of the main surface of the battery pack in plan view.
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公开(公告)号：US20170163229A1
公开(公告)日：2017-06-08
申请号：US15365092
申请日：2016-11-30
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Yasushi OYAMA , Takayuki TSUTSUI , Kazuhito NAKAI
CPC classification number: H03G1/0094 , H03F1/56 , H03F3/19 , H03F3/213 , H03F3/245 , H03F3/72 , H03F2200/111 , H03F2200/165 , H03F2200/222 , H03F2200/318 , H03F2200/387 , H03F2203/7209 , H03G2201/106 , H03G2201/40
Abstract: A power amplification module includes a first input terminal that receives a first transmit signal in a first frequency band, a second input terminal that receives a second transmit signal in a second frequency band having a narrower transmit/receive frequency interval than the first frequency band, a first amplification circuit that receives and amplifies the first transmit signal to produce a first amplified signal and outputs the first amplified signal, a second amplification circuit that receives and amplifies the second transmit signal to produce a second amplified signal and outputs the second amplified signal, a third amplification circuit that receives and amplifies the first or second amplified signal to produce an output signal and outputs the output signal, and an attenuation circuit located between the second input terminal and the second amplification circuit and configured to attenuate a receive frequency band component of the second frequency band.
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公开(公告)号：US20180212578A1
公开(公告)日：2018-07-26
申请号：US15926165
申请日：2018-03-20
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yasushi OYAMA , Takayuki TSUTSUI , Kazuhito NAKAI
CPC classification number: H03G1/0094 , H03F1/56 , H03F3/19 , H03F3/213 , H03F3/245 , H03F3/72 , H03F2200/111 , H03F2200/165 , H03F2200/222 , H03F2200/318 , H03F2200/387 , H03F2203/7209 , H03G2201/106 , H03G2201/40
Abstract: A power amplification module includes a first input terminal that receives a first transmit signal in a first frequency band, a second input terminal that receives a second transmit signal in a second frequency band having a narrower transmit/receive frequency interval than the first frequency band, a first amplification circuit that receives and amplifies the first transmit signal to produce a first amplified signal and outputs the first amplified signal, a second amplification circuit that receives and amplifies the second transmit signal to produce a second amplified signal and outputs the second amplified signal, a third amplification circuit that receives and amplifies the first or second amplified signal to produce an output signal and outputs the output signal, and an attenuation circuit located between the second input terminal and the second amplification circuit and configured to attenuate a receive frequency band component of the second frequency band.
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