公开(公告)号：US20220414415A1

公开(公告)日：2022-12-29

申请号：US17901324

申请日：2022-09-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihiro AOYAMA

IPC: G06K19/077

Abstract: A circuit module is provide that includes a substrate including a first surface and a second surface that are opposite to each other, an IC mounted on the first surface of the substrate, a circuit disposed on the first surface and the second surface of the substrate with a conductor pattern obtained by heat curing of conductive paste, and connected between the IC and an external circuit, and a dummy conductor pattern obtained by heat curing of the conductive paste, disposed on at least one of the first surface and the second surface of the substrate, and configured to maintain a balance of the conductive paste on the first surface and the second surface of the substrate.

公开(公告)号：US20130301230A1

公开(公告)日：2013-11-14

申请号：US13941762

申请日：2013-07-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihiro AOYAMA ,  Junya SHIMAKAWA

IPC: H01R13/56

CPC classification number: H01R13/56 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/112 ,  H05K3/3436 ,  H01L2924/00

Abstract: Based on a result of repeated analysis of stress caused by application of an external impact in a circuit board, which is rectangular or substantially rectangular in plan view and includes mounting electrodes, included in an electronic component, the mounting electrodes near four corners of the circuit board, of the mounting electrodes provided on a back surface of the circuit board included in the electronic component, are provided at positions shifted from diagonal lines of the back surface. Hence, the stress produced near the four corners of the circuit board is reduced, and this can effectively prevent a fracture, a chip, and a crack from being caused in the circuit board.

Abstract translation: 基于在平面图中矩形或大致矩形的电路板中施加外部冲击引起的应力的重复分析的结果，并且包括在电子部件中的安装电极，电路的四个角附近的安装电极 设置在电子部件中包括的电路板的背面上的安装电极的基板设置在从后表面的对角线偏移的位置处。 因此，电路板四角附近产生的应力减小，能够有效地防止在电路基板中产生断裂，芯片和裂纹。