公开(公告)号：US20200029444A1

公开(公告)日：2020-01-23

申请号：US16586062

申请日：2019-09-27

Applicant: FURUKAWA ELECTRIC CO., LTD. ,  MURATA MANUFACTURING CO., LTD.

Inventor： Takeo UNO ,  Yuko OKUNO ,  Takahiro TSURUTA ,  Yoshimasa NISHI ,  Sunao FUKUTAKE

IPC: H05K3/46 ,  H05K3/00 ,  H05K3/42 ,  H05K1/02

Abstract: A surface-treated copper foil of the present disclosure includes a copper foil substrate, at least one surface of which has a surface treatment coat including at least a roughening-treated surface on which roughening particles are formed. Observation of a cross-section of the surface-treated copper foil with a scanning electron microscope shows that on a surface of the surface treatment coat, a standard deviation of the particle height of the roughening particles is 0.16 μm or more and 0.30 μm or less, and an average value of the ratio of the particle height to the particle width (particle height/particle width) of the roughening particles is 2.30 or more and 4.00 or less.

公开(公告)号：US20190352565A1

公开(公告)日：2019-11-21

申请号：US16431908

申请日：2019-06-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshimasa NISHI ,  Sunao FUKUTAKE ,  Akira MORIYA ,  Kanto IIDA

IPC: C09K19/30 ,  C09K19/38 ,  C09K19/02 ,  H05K1/09

Abstract: A black liquid-crystal polymer film that contains a black pigment and a liquid crystal polymer and the black liquid-crystal polymer film has a lightness of 45 or less, a dielectric loss tangent of 0.0035 or less, a minimum dielectric breakdown strength of 60 kV/mm or more, and a maximum-to-minimum ratio of in-plane thermal linear expansion coefficient in the range of 1.0 to 2.5.

公开(公告)号：US20230119857A1

公开(公告)日：2023-04-20

申请号：US18081801

申请日：2022-12-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshimasa NISHI ,  Tomohiro NAGAI

IPC: B32B15/08 ,  H05K1/02 ,  H05K1/03 ,  H05K3/46 ,  B32B15/20 ,  B32B7/022

Abstract: A multilayer resin substrate includes resin layers that are laminated, a first copper foil on the resin layers and including first and second main surfaces having first and second surface roughnesses, respectively, and a second copper foil on the resin layers and including third and fourth main surfaces having third and fourth surface roughnesses, respectively. A distance between the first main surface and the second copper foil is shorter than a distance between the second main surface and the second copper foil. When the first, second, third, and fourth surface roughnesses are denoted as SR1, SR2, SR3, and SR4 respectively, a relationship SR1

公开(公告)号：US20210212204A1

公开(公告)日：2021-07-08

申请号：US17211400

申请日：2021-03-24

Applicant: FURUKAWA ELECTRIC CO., LTD. ,  MURATA MANUFACTURING CO., LTD.

Inventor： Takahiro TSURUTA ,  Takeo UNO ,  Yuko OKUNO ,  Sunao FUKUTAKE ,  Yoshimasa NISHI

IPC: H05K1/05 ,  B32B15/08 ,  B32B5/02 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  C25D3/38 ,  C25D5/00 ,  C25D7/06

Abstract: Provided is a surface-treated copper foil excellent in laser processability. The surface-treated copper foil includes a roughened surface formed by subjecting a surface to a roughening treatment, in which when measured using a three-dimensional roughness meter, the roughened surface has a surface skewness Ssk within a range of from −0.300 to less than 0 and an arithmetic mean summit curvature Ssc within a range of from 0.0220 nm−1 to less than 0.0300 nm−1.