Ceramic electronic component and method for manufacturing ceramic electronic component

    公开(公告)号:US11158459B2

    公开(公告)日:2021-10-26

    申请号:US16678074

    申请日:2019-11-08

    Abstract: A ceramic electronic component includes a ceramic body having first and second end surfaces facing each other, first and second side surfaces facing each other, first and second principal surfaces facing each other, and also includes outer electrodes each of which is provided on at least one portion of a corresponding one of the first and second end surfaces of the ceramic body. Each of the outer electrodes includes an underlying electrode layer provided on at least one portion of a corresponding one of the first and second end surfaces of the ceramic body and also includes a plating layer provided on a corresponding one of the underlying electrode layers and on a corresponding one of regions different from the underlying electrode layers.

    Electronic component and mounting structure

    公开(公告)号:US11776754B2

    公开(公告)日:2023-10-03

    申请号:US17510549

    申请日:2021-10-26

    CPC classification number: H01G4/2325 H01G2/065 H01G4/248 H01G4/30

    Abstract: An electronic component including a component body, and an external electrode on a surface of the component body. The external electrode includes a layer having an alloy of at least one first metal and at least one second metal, the at least one first metal is selected from the group consisting of metals of Group 9 to Group 11 of the Periodic Table, the at least one second metal has a melting point higher than that of the at least one first metal. In the layer having the alloy, a concentration of the at least one second metal continuously changes in a thickness direction of the external electrode, at least one first portion has the concentration of the at least one second metal increasing in the thickness direction, and at least one second portion has the concentration of the at least one second metal decreasing in the thickness direction.

Patent Agency Ranking