公开(公告)号：US20240242859A1

公开(公告)日：2024-07-18

申请号：US18562503

申请日：2022-03-04

申请人： NAGASE & CO., LTD.

发明人： Tamanobu NARUOKA ,  Noriaki SHIBATA

IPC分类号： H01B19/00 ,  B29C45/14 ,  B29C45/16 ,  B29K705/00 ,  B29L31/34 ,  H01B7/02

CPC分类号： H01B19/00 ,  B29C45/14336 ,  B29C45/14639 ,  B29C45/1642 ,  H01B7/02 ,  B29K2705/00 ,  B29K2995/0007 ,  B29L2031/34

摘要： A method for producing a conductive member in which an insulating film is interposed between two metal plates includes: a first molding step for forming an intermediate product in which a solidified, insulating first resin covers the insulating film, such that the insulating film is at least partially exposed; and a second molding step for covering sandwiching parts of the two metal plates with an insulating second resin in a state where at least a portion of the exposed part of the insulating film of the intermediate product is sandwiched between the two metal plates.

公开(公告)号：US20190304802A1

公开(公告)日：2019-10-03

申请号：US16367575

申请日：2019-03-28

申请人： NAGASE & CO., LTD.

发明人： Tamanobu NARUOKA ,  Kenro SHIBATA

IPC分类号： H01L21/48 ,  H01L23/498 ,  B29C45/76 ,  H01R13/10

摘要： There are provided a method of manufacturing a molded product for a power module capable of integrally molding terminals and a substrate, and a terminal in a particular shape used for the manufacturing method. The method of manufacturing the molded product for a power module includes the steps of: inserting a first tip portion of each of terminals having a particular shape into a substrate; arranging the substrate in a mold such that the second tip portion is inserted into a terminal insertion portion inside the mold; and integrally molding the substrate and the terminals by flowing resin into the mold.