公开(公告)号：US09497865B2

公开(公告)日：2016-11-15

申请号：US14043609

申请日：2013-10-01

Applicant: NAN YA PCB Corporation

Inventor： Hung-Wei Chang ,  Tai-Yi Chou

IPC: H05K3/46 ,  H05K3/34 ,  H05K3/00

CPC classification number: H05K3/4661 ,  H05K3/0052 ,  H05K3/3452 ,  H05K2201/0909 ,  Y10T29/49155

Abstract: A method for forming a printed circuit board includes providing a substrate including a first device region, a second device region and a dicing channel region between the first device region and the second device region. A first circuit is formed on the substrate. An insulating layer is formed on the first circuit and the substrate. At least one build-up circuit is formed on the insulating layer. A photoresist layer is formed on the at least one build-up circuit. An image transferring process is performed to pattern the photoresist layer to form a dam structure in the dicing channel region. A solder mask layer is formed on the at least one build-up circuit. The dam structure is removed to form a trench in the solder mask layer.

Abstract translation: 一种用于形成印刷电路板的方法，包括在第一器件区域和第二器件区域之间提供包括第一器件区域，第二器件区域和切割沟道区域的衬底。 在基板上形成第一电路。 在第一电路和基板上形成绝缘层。 在绝缘层上形成至少一个积聚电路。 在至少一个积聚电路上形成光致抗蚀剂层。 执行图像转印处理以对切割通道区域中的光致抗蚀剂层进行图案化以形成坝结构。 在至少一个积聚电路上形成焊接掩模层。 去除坝结构以在焊接掩模层中形成沟槽。

公开(公告)号：US20140216787A1

公开(公告)日：2014-08-07

申请号：US14043609

申请日：2013-10-01

Applicant: NAN YA PCB Corporation

Inventor： Hung-Wei Chang ,  Tai-Yi Chou

IPC: H05K3/28 ,  H05K1/02

CPC classification number: H05K3/4661 ,  H05K3/0052 ,  H05K3/3452 ,  H05K2201/0909 ,  Y10T29/49155

Abstract: A method for forming a printed circuit board is disclosed. A substrate including a first device region, a second device region and a dicing channel region between the first device region and the second device region is provided. A first circuit is formed on the substrate. An insulating layer is formed on the first circuit and the substrate. At least one build-up circuit is formed on the insulating layer. A photoresist layer is formed on the at least one build-up circuit. An image transferring process is performed to pattern the photoresist layer to form a dam structure in the dicing channel region. A solder mask layer is formed on the at least one build-up circuit. The dam structure is removed to form a trench in the solder mask layer.

Abstract translation: 公开了一种形成印刷电路板的方法。 提供了包括在第一器件区域和第二器件区域之间的第一器件区域，第二器件区域和切割沟道区域的衬底。 在基板上形成第一电路。 在第一电路和基板上形成绝缘层。 在绝缘层上形成至少一个积聚电路。 在至少一个积聚电路上形成光致抗蚀剂层。 执行图像转印处理以对切割通道区域中的光致抗蚀剂层进行图案化以形成坝结构。 在至少一个积聚电路上形成焊接掩模层。 去除坝结构以在焊接掩模层中形成沟槽。