Abstract:
A printed circuit board is provided, including a products area, an outline area, a plurality of cutting channels, and at least one measurement unit. The products area includes a plurality of circuit board units arranged in a matrix, and each of the circuit board units has a plurality of first internal wiring layers. The outline area surrounds the products area. The cutting channels are located between the outline area and the circuit board units, and between the circuit board units. The measurement unit is disposed in one of the cutting channels and has a plurality of second internal wiring layers and a plurality of contact pads. The second internal wiring layers and the first internal wiring layers are formed by the same fabrication processes. The contact pads are electrically connected to the second internal wiring layers and exposed to a surface of the printed circuit board.
Abstract:
An embedded component substrate and methods for fabricating the same are provided. The embedded component substrate includes a substrate having at least one cavity, a first surface, and a second surface. The embedded component substrate also includes at least one electronic component formed in the at least one cavity. The embedded component substrate also includes a first wiring layer formed in the space between a sidewall of the at least one electronic component and a sidewall of the at least one cavity. The first wiring layer extends from the first surface of the substrate to the sidewall of the at least one cavity, and directly contacts the at least one electronic component.
Abstract:
A method for forming a printed circuit board includes providing a substrate including a first device region, a second device region and a dicing channel region between the first device region and the second device region. A first circuit is formed on the substrate. An insulating layer is formed on the first circuit and the substrate. At least one build-up circuit is formed on the insulating layer. A photoresist layer is formed on the at least one build-up circuit. An image transferring process is performed to pattern the photoresist layer to form a dam structure in the dicing channel region. A solder mask layer is formed on the at least one build-up circuit. The dam structure is removed to form a trench in the solder mask layer.
Abstract:
An embedded component substrate and methods for fabricating the same are provided. The embedded component substrate includes a substrate having at least one cavity, a first surface, and a second surface. The embedded component substrate also includes at least one electronic component formed in the at least one cavity. The embedded component substrate also includes a first wiring layer formed in the space between the at least one electronic component and the at least one cavity. The first wiring layer extends from the first surface of the substrate to a sidewall of the at least one cavity, and directly contacts the at least one electronic component.
Abstract:
A method for forming a printed circuit board is disclosed. A substrate including a first device region, a second device region and a dicing channel region between the first device region and the second device region is provided. A first circuit is formed on the substrate. An insulating layer is formed on the first circuit and the substrate. At least one build-up circuit is formed on the insulating layer. A photoresist layer is formed on the at least one build-up circuit. An image transferring process is performed to pattern the photoresist layer to form a dam structure in the dicing channel region. A solder mask layer is formed on the at least one build-up circuit. The dam structure is removed to form a trench in the solder mask layer.