公开(公告)号：US20240342968A1

公开(公告)日：2024-10-17

申请号：US18632326

申请日：2024-04-11

申请人： NANJING UNIVERSITY ,  JIANGSU HHCK ADVANCED MATERIALS CO., LTD.

发明人： Wei CHEN ,  Qi XUE ,  Huijie ZHUANG ,  Linling LI ,  Jianglong HAN ,  Dongshan ZHOU ,  Xiaoliang WANG

IPC分类号： B29C45/14 ,  B29C35/16 ,  B29C45/73 ,  B29K33/00 ,  B29K81/00 ,  B29L31/34 ,  C25D11/02 ,  H05K1/02 ,  H05K1/03

CPC分类号： B29C45/14311 ,  B29C35/16 ,  C25D11/02 ,  H05K1/0237 ,  H05K1/0353 ,  B29C2035/165 ,  B29C2045/14868 ,  B29C45/73 ,  B29K2033/12 ,  B29K2081/04 ,  B29L2031/3425

摘要： A metal-resin composite, a surface treatment method, and a substrate of a printed circuit board (PCB) for high-frequency and high-speed signal transmission comprise a surface-treated metal, and the surface-treated metal includes a nano-scale pore array that is used for filling of a resin and vertically extends from a surface to an interior of a metal, where nano-scale pillars are provided to extend from bottoms to openings of nano-scale pores of the nano-scale pore array. The pillar-in-pore structure makes a resin entering a nano-scale pore have an ultra-high anchoring effect on a resin body outside the nano-scale pore. Therefore, on the premise of not using an additive such as a T liquid or a coupling agent, the present disclosure greatly improves a tensile bonding strength at an interface between a resin body and a metal substrate, and also eliminates a decline in an interfacial bonding strength of a composite.