公开(公告)号：US20240328027A1

公开(公告)日：2024-10-03

申请号：US17909476

申请日：2020-03-11

申请人： GREEN RESOURCE CO., LTD.

发明人： Jong Beom LEE ,  Jong Soo LEE ,  Byounggook KWON

IPC分类号： C23C14/08 ,  C23C14/02 ,  C23C14/10 ,  C23C14/24 ,  C23C14/58

CPC分类号： C30B1/023 ,  C23C14/022 ,  C23C14/081 ,  C23C14/083 ,  C23C14/10 ,  C23C14/24 ,  H01J37/32495

摘要： A method for manufacturing a coating material formed on an inner surface of a chamber is provided. The method includes: i) providing a substrate including at least one material selected from the group consisting of SiC, SiO2, and Al2O3; ii) providing a first coating portion including SiOx (0.1≤x≤2 as a molar ratio) or AlOy (0.1≤y≤1.5 as a molar ratio) on the substrate; iii) providing a second coating portion including YOz (0.1≤z≤1.5 as a molar ratio) on the first coating portion; iv) providing a laminate in which the first coating portion and the second coating portion are repeatedly stacked; and v) heating the laminate to provide a coating layer of a single crystalline layer by a solid-state reaction between the first coating portion and the second coating portion.

公开(公告)号：US12042219B2

公开(公告)日：2024-07-23

申请号：US18069370

申请日：2022-12-21

申请人： St. Jude Medical, Cardiology Division, Inc.

发明人： Derek Sutermeister ,  Edward E. Parsonage ,  Gregory K. Olson

IPC分类号： A61B18/14 ,  B23K26/352 ,  C25D7/00 ,  A61B17/00 ,  A61B18/00 ,  A61N1/04 ,  A61N1/05 ,  A61N1/362 ,  C23C14/02 ,  C23C16/02 ,  C25D5/34

CPC分类号： A61B18/1492 ,  B23K26/355 ,  C25D7/00 ,  A61B2017/00526 ,  A61B2018/00011 ,  A61B2018/00119 ,  A61B2018/00136 ,  A61B2018/00148 ,  A61B2018/00178 ,  A61B2018/00351 ,  A61B2018/00577 ,  A61B2018/00642 ,  A61B2018/00839 ,  A61B2018/1467 ,  A61N1/0472 ,  A61N1/05 ,  A61N1/362 ,  C23C14/022 ,  C23C16/0227 ,  C25D5/34

摘要： A medical device includes a body and at least one electrode disposed thereon. The electrode includes a metallic substrate, such as a platinum group metal, an alloy of platinum group metals, or gold. The surface of the substrate is modified in a manner that increases its effective surface area without inducing bulk heating. For example, the surface of the substrate can be laser textured and/or coated, such as with titanium nitride or iridium oxide.

公开(公告)号：US20240117483A1

公开(公告)日：2024-04-11

申请号：US18275775

申请日：2022-02-28

申请人： NATIONAL INSTITUTE FOR MATERIALS SCIENCE

发明人： Akihiro KIKUCHI ,  Hitoshi KITAGUCHI ,  Yasuo IIJIMA ,  Kazuto HIRATA

IPC分类号： C23C14/16 ,  C23C14/02 ,  C23C14/32 ,  C23C14/58

CPC分类号： C23C14/16 ,  C23C14/022 ,  C23C14/32 ,  C23C14/5806 ,  C23C14/5886

摘要： The problem addressed by the present invention is to provide a copper-coated aluminum wire material with a reduced weight and excellent adhesiveness, and a production method therefor.
This copper-coated aluminum wire material is provided with an aluminum wire material comprising aluminum or an aluminum alloy and a thin copper film covering the aluminum wire material. The space factor of the thin copper film is in the range of 0.2% to 4% and the adhesiveness between the aluminum wire material and the thin copper film based on a scratch test compliant with JIS R 3255 is at least 10 mN.

公开(公告)号：US20240106123A1

公开(公告)日：2024-03-28

申请号：US17899750

申请日：2022-08-31

申请人： Northrop Grumman Systems Corporation

发明人： Dah-Weih Duan ,  Elizabeth T Kunkee

IPC分类号： H01Q9/04 ,  C23C14/02 ,  C23C14/18 ,  C23C14/34 ,  C23C28/02 ,  C25D3/48 ,  C25D5/54 ,  C25D7/12 ,  H01Q1/48

CPC分类号： H01Q9/0407 ,  C23C14/022 ,  C23C14/185 ,  C23C14/34 ,  C23C28/023 ,  C25D3/48 ,  C25D5/54 ,  C25D7/123 ,  H01Q1/48

摘要： An exemplary RF module includes a dielectric substrate with metal traces on one surface that connect high frequency components and provide reference ground. Other metal traces on the other surface of the substrate also provide high frequency transmission lines and reference ground. An enclosure made using semiconductor manufacturing technology is mounted to the substrate and has conductive interior recesses defined by extending walls that are connected to the reference ground. The recesses surround the respective components and provide electromagnetic shielding. The dimensional precision in the location and smoothness of the walls and recesses due to the semiconductor manufacturing technology provides repeatable unit-to-unit RF characteristics of the RF module. One way of mounting the enclosure to the substrate uses a plurality of metal bonding bumps extending outwardly from the walls to engage reference ground metal traces on the substrate. Applied pressure deforms the bonding bumps to form a metal-to-metal bond.

公开(公告)号：US11920236B2

公开(公告)日：2024-03-05

申请号：US17357296

申请日：2021-06-24

申请人： SANVAC (BEIJING) MAGNETICS CO., LTD. ,  BEIJING ZHONG KE SAN HUAN HI-TECH CO., LTD.

发明人： Guoan Chen ,  Bin Fang ,  Haojie Wang ,  Yugang Zhao

IPC分类号： B32B15/01 ,  C23C14/02 ,  C23C14/16 ,  C23C14/34 ,  H01F1/057 ,  H01F41/02

CPC分类号： C23C14/165 ,  B32B15/01 ,  C23C14/022 ,  C23C14/3464 ,  H01F1/057 ,  H01F41/0253 ,  B32B2307/208

摘要： A composite coating layer for coating a NdFeB rare earth magnet includes a first coating layer and a second coating layer formed over a surface of the first coating layer. The first coating layer includes a Nd coating layer, a Pr coating layer, or an alloy coating layer including two or more of Nd, Pr, and Cu. The second coating layer includes a Tb coating layer.

公开(公告)号：US11901172B2

公开(公告)日：2024-02-13

申请号：US17090280

申请日：2020-11-05

申请人： EV Group E. Thallner GmbH

发明人： Nasser Razek

IPC分类号： H01L21/02 ,  C23C14/02 ,  H01L21/67 ,  C23C16/50 ,  H01J37/32

CPC分类号： H01L21/02046 ,  C23C14/022 ,  C23C16/50 ,  H01J37/32009 ,  H01L21/67028 ,  H01J2237/08 ,  H01J2237/3137 ,  H01J2237/3151

摘要： A method for the surface treatment of a substrate surface of a substrate includes arranging the substrate surface in a process chamber, bombarding the substrate surface with an ion beam, generated by an ion beam source and aimed at the substrate surface, to remove impurities from the substrate surface, whereby the ion beam has a first component, and introducing a second component into the process chamber to bind the removed impurities. A device for the surface treatment of a substrate surface of a substrate includes a process chamber for receiving the substrate, an ion beam source for generating an ion beam that has a first component and is aimed at the substrate surface to remove impurities from the substrate surface, and means to introduce a second component into the process chamber to bind the removed impurities.

公开(公告)号：US20230405686A1

公开(公告)日：2023-12-21

申请号：US18018886

申请日：2022-06-15

申请人： Sumitomo Electric Hardmetal Corp.

发明人： Yuta SUZUKI ,  Shinya IMAMURA

IPC分类号： B23B27/14 ,  C23C14/32 ,  C23C14/50 ,  C23C14/02 ,  C23C14/06

CPC分类号： B23B27/148 ,  C23C14/325 ,  C23C14/505 ,  C23C14/022 ,  C23C14/0647 ,  B23B2228/105

摘要： A cutting tool comprising a base material and a coating, wherein the coating includes a first layer having a multilayer structure in which a first unit layer and a second unit layer are alternately stacked; a thickness of the first unit layer is 2 to 50 nm; a thickness of the second unit layer is 2 to 50 nm; a thickness of the first layer is 1.0 μm or more and 20 μm or less, the first unit layer is composed of TiaAlbBcN, and the second unit layer is composed of TidAleBfN, wherein 0.49≤a≤0.70, 0.19≤0.40, 0.10

公开(公告)号：US20230220556A1

公开(公告)日：2023-07-13

申请号：US17997745

申请日：2021-04-27

申请人： Westinghouse Electric Company LLC

发明人： Benjamin R. MAIER ,  Allan W. JAWORSKI ,  Jorie L. WALTERS

IPC分类号： C23C28/02 ,  B32B15/01 ,  C25D7/04 ,  C25D3/06 ,  C23C14/02 ,  C23C14/16 ,  C22C16/00 ,  G21C3/07 ,  G21C21/14

CPC分类号： C23C28/021 ,  B32B15/01 ,  C23C28/023 ,  C25D7/04 ,  C25D3/06 ,  C23C14/022 ,  C23C14/025 ,  C23C14/16 ,  C22C16/00 ,  G21C3/07 ,  G21C21/14

摘要： Plated metallic substrates and methods of manufacture are provided. The method comprises depositing a first layer onto at least a portion of the metallic substrate to create a coated substrate utilizing physical vapor deposition. The method comprises electroplating a second layer comprising chromium, a chromium alloy, or a combination thereof onto at least a portion of the first layer to create a plated substrate.

公开(公告)号：US20180251901A1

公开(公告)日：2018-09-06

申请号：US15960524

申请日：2018-04-23

申请人： Mohammad Abdolahad ,  Mohammad Ali Khayamian ,  Ashkan Zandi

发明人： Mohammad Abdolahad ,  Mohammad Ali Khayamian ,  Ashkan Zandi

IPC分类号： C25B1/02 ,  C25B9/06 ,  C25B11/04 ,  C23C14/20 ,  C23C14/34 ,  C23C14/58 ,  C23C14/00 ,  G01N27/48 ,  A61B5/1473 ,  G01N33/49

CPC分类号： G01N27/48 ,  A61B5/1473 ,  C23C14/0005 ,  C23C14/022 ,  C23C14/205 ,  C23C14/3464 ,  C23C14/5806 ,  C23C14/5846 ,  C25B1/02 ,  C25B9/06 ,  C25B11/0405 ,  C25B11/0415 ,  C25B11/0478 ,  G01N27/327 ,  G01N33/4833 ,  G01N33/49 ,  G03F7/70

摘要： A method for in-situ generation of microbubbles is disclosed. The method includes preparing an electrochemical apparatus, where the electrochemical apparatus includes a substrate and an integrated three-electrodes array patterned on the substrate. The integrated three-electrodes array includes a working electrode, a reference electrode, and a counter electrode. The method further includes growing a nano-structured layer on the working electrode of the integrated three-electrodes array, putting the electrochemical apparatus in contact with a medium fluid, electrolyzing the medium fluid by applying an instantaneous electrical potential to the electrochemical apparatus, and generating a plurality of microbubbles around the electrochemical apparatus in contact with the medium fluid responsive to electrolyzing of the medium fluid.

公开(公告)号：US20180245214A1

公开(公告)日：2018-08-30

申请号：US15753030

申请日：2016-08-17

申请人： TATA STEEL NEDERLAND TECHNOLOGY B.V.

发明人： Edzo ZOESTBERGEN ,  Theodorus Franciscus Jozef MAALMAN ,  Johan Jacob Hendrik WESSELINK

IPC分类号： C23C14/56 ,  C23C14/02 ,  C23C14/16

CPC分类号： C23C14/564 ,  C11D11/0029 ,  C23C14/021 ,  C23C14/022 ,  C23C14/16 ,  C23C14/562 ,  C23C14/5886

摘要： A method and an apparatus for cleaning and coating a metal strip wherein the metal strip is cleaned in a cleaning chamber connected to a deposition chamber and wherein the vacuum pressure in the cleaning chamber is kept in the range of 0.01-100 mbar and the vacuum pressure in the deposition chamber in the range of 0.01-10 mbar.