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公开(公告)号:US20240213364A1
公开(公告)日:2024-06-27
申请号:US18556293
申请日:2022-04-15
Inventor: Yoshinao MIURA , Akira NAKAJIMA , Xu-Qiang SHEN , Hirohisa HIRAI , Shinsuke HARADA
IPC: H01L29/78 , H01L21/265 , H01L29/20 , H01L29/861
CPC classification number: H01L29/7811 , H01L21/265 , H01L29/2003 , H01L29/7813 , H01L29/8613
Abstract: There is provided a semiconductor equipment including: an element area having an n-type layer, a first p-type layer on the n-type layer, and a second p-type layer on the first p-type layer, the second p-type layer having an acceptor concentration higher than the first p-type layer; and an electric field relaxation region surrounding the element area, in which in the electric field relaxation region, a region containing an impurity element that inactivates a part of acceptors in the first p-type layer and the second p-type layer is provided in the first p-type layer and the second p-type layer.
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公开(公告)号:US20240332281A1
公开(公告)日:2024-10-03
申请号:US18737031
申请日:2024-06-07
Inventor: Akira NAKAJIMA , Shinsuke HARADA , Kazutoshi KOJIMA
IPC: H01L27/02 , H01L29/20 , H01L29/778
CPC classification number: H01L27/0255 , H01L29/2003 , H01L29/7786
Abstract: A destructive breakdown mode that leads to the destruction of a device is suppressed, in the case where a gallium nitride-based high electron mobility transistor is used as a power device. A diode is connected in antiparallel to a HEMT, and this antiparallel connected diode is designed such that an avalanche breakdown occurs therein before the drain-source voltage, which is the difference between the drain potential applied to a drain electrode and the source potential applied to a source electrode, exceeds the withstand voltage of the HEMT.
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