公开(公告)号：US09697954B2

公开(公告)日：2017-07-04

申请号：US14430700

申请日：2013-09-11

Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY

Inventor： Kenichi Nomura ,  Hirobumi Ushijima ,  Noriko Iwase ,  Manabu Yoshida

IPC: B05D5/12 ,  H01G4/30 ,  H05K3/20 ,  C09D11/037 ,  C09D11/52 ,  H01G4/12 ,  H01L31/0224 ,  H05K3/12 ,  H01G13/00 ,  H01G4/228

CPC classification number: H01G4/308 ,  C09D11/037 ,  C09D11/52 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/12 ,  H01G4/228 ,  H01G4/30 ,  H01G13/00 ,  H01G13/006 ,  H01L31/022425 ,  H05K3/1216 ,  H05K3/1275 ,  H05K3/207 ,  H05K2203/0143 ,  H05K2203/0537 ,  Y02E10/50

Abstract: The invention provides a process and an apparatus for producing a high quality electronic component by reducing sagging at pattern side walls, which may occur when patterns of a wiring, an electrode, etc. are printed by a screen printing process using an electroconductive paste, an insulation paste, or a semiconductor paste, and reducing a mesh mark on the patterns of a wiring, an electrode, etc., or a full solid surface film, as well as a pattern formation process, by which screen printing can be applied and double face printing can be conducted with the number of process steps less than a conventional process. A pattern is formed by that a pattern is printed on a blanket having a surface comprising polydimethylsiloxane using an electroconductive paste, an insulation paste, or a semiconductor paste by a screen printing process, and the pattern is transferred from the blanket to a printing object.

公开(公告)号：US20150243441A1

公开(公告)日：2015-08-27

申请号：US14430700

申请日：2013-09-11

Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY

Inventor： Kenichi Nomura ,  Hirobumi Ushijima ,  Noriko Iwase ,  Manabu Yoshida

IPC: H01G4/30 ,  H05K3/12

CPC classification number: H01G4/308 ,  C09D11/037 ,  C09D11/52 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/12 ,  H01G4/228 ,  H01G4/30 ,  H01G13/00 ,  H01G13/006 ,  H01L31/022425 ,  H05K3/1216 ,  H05K3/1275 ,  H05K3/207 ,  H05K2203/0143 ,  H05K2203/0537 ,  Y02E10/50

Abstract: The invention provides a process and an apparatus for producing a high quality electronic component by reducing sagging at pattern side walls, which may occur when patterns of a wiring, an electrode, etc. are printed by a screen printing process using an electroconductive paste, an insulation paste, or a semiconductor paste, and reducing a mesh mark on the patterns of a wiring, an electrode, etc., or a full solid surface film, as well as a pattern formation process, by which screen printing can be applied and double face printing can be conducted with the number of process steps less than a conventional process. A pattern is formed by that a pattern is printed on a blanket having a surface comprising polydimethylsiloxane using an electroconductive paste, an insulation paste, or a semiconductor paste by a screen printing process, and the pattern is transferred from the blanket to a printing object.

Abstract translation: 本发明提供了一种用于通过减少图案侧壁的下垂来生产高质量电子部件的方法和装置，当通过使用导电浆料的丝网印刷方法印刷布线，电极等的图案时可能发生的凹凸， 绝缘膏或半导体糊料，并且减少布线，电极等或全固体表面膜的图案上的网痕，以及可应用丝网印刷的图案形成工艺，并且双重 可以以比常规方法小的工艺步骤的数量进行面印。 通过丝网印刷方法，使用导电浆料，绝缘膏或半导体糊料将图案印刷在具有包含聚二甲基硅氧烷的表面的毯子上，并且将图案从毯子转印到印刷对象上形成图案。