公开(公告)号：US20150126031A1

公开(公告)日：2015-05-07

申请号：US14596355

申请日：2015-01-14

Applicant: NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY

Inventor： Owen HILDRETH

IPC: H01L21/285 ,  H01L21/306 ,  C23C18/31 ,  C23C18/18 ,  C23C18/16

CPC classification number: C23C18/1608 ,  C23C18/1879 ,  C23C18/31 ,  C25F3/12 ,  H01L21/28506 ,  H01L21/306 ,  H01L21/30604 ,  H01Q17/00

Abstract: A process for depositing a metal includes disposing an activating catalyst on a substrate; contacting the activating catalyst with a metal cation from a vapor deposition composition; contacting the substrate with a reducing anion from the vapor deposition composition; performing an oxidation-reduction reaction between the metal cation and the reducing anion in a presence of the activating catalyst; and forming a metal from the metal cation to deposit the metal on the substrate. A system for depositing a metal includes an activating catalyst to deposit on a substrate; and a primary reagent to form: a metal cation to deposit on the substrate as a metal; and a reducing anion to provide electrons to the activating catalyst, the metal cation, the substrate, or a combination thereof, wherein the primary reagent forms the metal cation and the reducing anion in response to being subjected to a dissociating condition

Abstract translation: 沉积金属的方法包括在基板上设置活化催化剂; 使活化催化剂与来自气相沉积组合物的金属阳离子接触; 使基板与来自气相沉积组合物的还原性阴离子接触; 在活化催化剂的存在下，在金属阳离子和还原性阴离子之间进行氧化还原反应; 以及从金属阳离子形成金属以将金属沉积在基底上。 用于沉积金属的系统包括沉积在基底上的活化催化剂; 以及形成金属阳离子作为金属沉积在基材上的初级试剂; 和还原阴离子，以向活化催化剂，金属阳离子，底物或其组合提供电子，其中初级试剂响应于经受解离条件而形成金属阳离子和还原性阴离子