LASER PROCESSING SYSTEM
    1.
    发明公开

    公开(公告)号:US20230302571A1

    公开(公告)日:2023-09-28

    申请号:US18172311

    申请日:2023-02-22

    Inventor: Hung-Wen Chen

    Abstract: A laser processing system configured to provide a processing beam is provided. The laser processing system includes a laser, a beam splitting module, a first adjustment module, and a second adjustment module. The laser is configured to provide a laser beam. The beam splitting module is configured to split the laser beam into a first laser beam and a second laser beam. The first adjustment module is disposed on a transmission path of the first laser beam and configured to adjust the first laser beam to a central portion of the processing beam. The second adjustment module is disposed on a transmission path of the second laser beam and configured to adjust the second laser beam to an outer ring portion of the processing beam.

    LASER COLORED PRODUCT, LASER COLORING METHOD THEREFOR, AND LASER COLORING SYSTEM USING THE SAME

    公开(公告)号:US20240383268A1

    公开(公告)日:2024-11-21

    申请号:US18397636

    申请日:2023-12-27

    Abstract: A laser colored product, a laser coloring method therefor, and a laser coloring system using the same are provided. The laser coloring method comprises the following steps. First, provide a processing workpiece which includes a processing part, and the processing part includes a pattern region. The processing part within the pattern region includes an inner portion and an outer layer, and the outer layer includes metal materials. Use the laser coloring system to irradiate the outer layer of the pattern region in stages to convert the outer layer of the pattern region into a metal color pattern layer. The metal color pattern layer includes metal materials or metal compounds of metal materials, and the metal color pattern layer includes a plurality of pixel units arranged in arrays, wherein each of the pixel units includes a pixel color, and each of the pixel units has a pixel width or a pixel length between 1 μm to 500 μm.

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