Reflection-type liquid crystal display and method for manufacturing the same

    公开(公告)号:US20040196419A1

    公开(公告)日:2004-10-07

    申请号:US10831118

    申请日:2004-04-26

    CPC classification number: G02F1/136227 G02F1/133345 G02F1/133553

    Abstract: A reflection-type liquid crystal display according to the invention includes two glass substrates, a transparent electrode provided on one glass substrate, an insulator film which is provided on another glass substrate and on which an uneven structure is formed, a reflecting electrode provided on the insulator film, and a liquid crystal layer sandwiched between a side of the transparent electrode and a side of the reflecting electrode. The insulator film includes a first insulating layer in which a large number of depressions isolated as surrounded by protrusions are irregularly arranged and a second insulating layer covering the insulating layer entirely. The protrusions are all connected in a network, so that if some of these protrusions have weaker adherence with an underlying layer, they can be supported by the surrounding protrusions.

    Active matrix substrate and manufacturing method therefor

    公开(公告)号:US20040084672A1

    公开(公告)日:2004-05-06

    申请号:US10617035

    申请日:2003-07-11

    Abstract: An active matrix substrate of a channel protection type having a gate electrode, a drain electrode and a pixel electrode isolated from one another from layer to layer by insulating films. The active matrix substrate is to be prepared by four masks. A gate electrode layer, a gate insulating film and an a-Si layer are processed to the same shape on a transparent insulating substrate to form a gate electrode layer (102 of FIG. 6) and a TFF area. A drain electrode layer (106 of FIG. 6) is formed by a first passivation film (105 of FIG. 6) via a first passivation film (105 of FIG. 6) formed as an upper layer. In a second passivation film (107 of FIG. 6) formed above it are bored an opening through the first and second passivation films and an opening through the second passivation film. A wiring connection layer is formed by ITO (108 of FIG. 6) provided as an uppermost layer. A storage capacitance unit, comprised of the first and second passivation films sandwiched between the gate electrode and an electrode layer formed as a co-layer with respect to the gate electrode, is provided in the pixel electrode.

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