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公开(公告)号：US09608194B2
公开(公告)日：2017-03-28
申请号：US14037956
申请日：2013-09-26
申请人： NGK Insulators, Ltd.
发明人： Takatomo Ogata , Haruhiko Ito
IPC分类号： H01L41/083 , H01L41/22 , H01L41/273 , H01L41/293 , H01L41/297 , H01L41/047 , H01L41/08 , G01L1/16
CPC分类号： H01L41/22 , G01L1/16 , G03B2205/0061 , H01L41/0471 , H01L41/0472 , H01L41/08 , H01L41/273 , H01L41/293 , H01L41/297 , Y10T29/42
摘要： A plurality of piezoelectric device corresponding parts including a green main body part and a green top surface electrode formed on a top surface of the green main body part are placed on a tabular substrate at intervals. Next, a tabular elastic body is pressed from above to the plurality of piezoelectric device corresponding parts, so as to form an inclined part declined toward an outer side in an edge of a top surface of each piezoelectric device corresponding part, and to form a circular arc part at an intersection between the inclined part and a side surface of the piezoelectric device corresponding part. Next, a green side surface electrode is formed on the side surface of each piezoelectric device corresponding part so that the green side surface electrode is connected to the green top surface electrode. Next, this molded body is sintered so that a piezoelectric device is obtained.
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公开(公告)号：US11538983B2
公开(公告)日：2022-12-27
申请号：US16812742
申请日：2020-03-09
发明人： Isamu Oguma , Takatomo Ogata , Shigeru Funabashi , Hidetake Ota
IPC分类号： H01L41/338 , H01L21/683
摘要： Provided is a chip component manufacturing method which enables a plurality of chip pieces to be handled while being pasted to a sheet, and in which it is possible to apply at least a surface treatment to a plurality of chip pieces while being pasted to a sheet. This chip component manufacturing method comprises: a step for retaining a green sheet or the like on a carrier sheet; a step for cutting, together with a portion of the carrier sheet, the green sheet or the like retained on the carrier sheet; a step for removing, together with a portion of the carrier sheet, at least a dummy portion of the green sheet or the like that has been cut, so as to leave a plurality of chip pieces on the carrier sheet; and a step for applying at least a surface treatment to lateral surface portions of the plurality of chip pieces that have become exposed due to the removing while the plurality of chip pieces are being retained on the carrier sheet.
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公开(公告)号：US10749099B2
公开(公告)日：2020-08-18
申请号：US15473989
申请日：2017-03-30
申请人： NGK INSULATORS, LTD.
IPC分类号： H01L41/047 , H01L41/083 , H01L41/297
摘要： The piezoelectric element comprises a piezoelectric body extending in a lateral direction and a first and second electrodes that are provided on the piezoelectric body. The piezoelectric body has an active portion sandwiched between the first and second electrodes in a thickness direction that is vertical to the lateral direction, and an inactive portion connected to the active portion in the lateral direction. The first electrode has an active electrode portion disposed on the active portion. The active electrode portion includes an interface region that is adjacent to the interface of the active portion and the inactive portion in the lateral direction, and an inner region that is separated from the interface of the active portion and the inactive portion in the lateral direction. The cross sectional surface area per unit length of the interface region in the cross section of the active electrode portion is greater than the cross sectional area per unit length of the inner region.
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公开(公告)号：US20200212289A1
公开(公告)日：2020-07-02
申请号：US16812742
申请日：2020-03-09
发明人： Isamu Oguma , Takatomo Ogata , Shigeru Funabashi , Hidetake Ota
IPC分类号： H01L41/338 , H01L21/683
摘要： Provided is a chip component manufacturing method which enables a plurality of chip pieces to be handled while being pasted to a sheet, and in which it is possible to apply at least a surface treatment to a plurality of chip pieces while being pasted to a sheet. This chip component manufacturing method comprises: a step for retaining a green sheet or the like on a carrier sheet; a step for cutting, together with a portion of the carrier sheet, the green sheet or the like retained on the carrier sheet; a step for removing, together with a portion of the carrier sheet, at least a dummy portion of the green sheet or the like that has been cut, so as to leave a plurality of chip pieces on the carrier sheet; and a step for applying at least a surface treatment to lateral surface portions of the plurality of chip pieces that have become exposed due to the removing while the plurality of chip pieces are being retained on the carrier sheet.
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