公开(公告)号：US20240342999A1

公开(公告)日：2024-10-17

申请号：US18684869

申请日：2022-10-06

Applicant: NHK Spring Co., Ltd.

Inventor： Hidetoshi Mizuta ,  Atom Furuse ,  Kaoru Nagasawa ,  Fumitaka Arai

IPC: B29C65/14 ,  B29C65/00

CPC classification number: B29C65/1416 ,  B29C66/742 ,  B60G2206/821

Abstract: A bonding method bonds a buffer member to an adherend member, and includes: an adhesive application step of applying an adhesive to a part of the buffer member, the part being bonded to the adherend member; a first heating step of heating a part of the adherend member, the part being bonded to the buffer member; a second heating step of heating the part of the adherend member after the first heating step; and an attachment step of attaching the buffer member to the adherend member after the second heating step.